Integrable miniaturized folded antennas for RFID applications

Low cost, low profile, and miniaturized size are the most critical factors needed to consider in the design of antennas for RFID applications. We present two simple folded structures based on integrable packaging processes. The first one is a 3D folded patch implemented on LTCC multilayer technology while the second is a printed folded strip antenna fabricated on RT/Duroid board. The dimensions of the folded patch antenna are approximately /spl lambda//sub 0//16/spl times//spl lambda//sub 0//16 and the maximum length of the folded strip is less than /spl lambda//sub 0//10. Both antennas have a peak gain of 0 dBi.

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