Effects of process variation on signal integrity for high speed differential signaling on package level

This paper presents the effects of the manufacturing process variation on the signal integrity of differential interconnects on package level structure. We have shown that the variation of the manufacturing process has a critical impact on the signal integrity of the differential lines, which results in significant distortion of the transmitted waveform. We have conducted full wave simulation, circuit simulation based on equations, and measurement using TDR system to investigate the relationship between process variation and signal integrity with electrical characteristic parameter analysis.

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