Versatile MOR-based boundary condition independent compact thermal models with multiple heat sources

Abstract This paper shows that the connection of MOR-based boundary condition independent (BCI) dynamic compact thermal models (DCTMs) and detailed models of heat transfer problems is not straightforward and is subject to numerical issues. In order to overcome this drawback, a novel definition of MOR-based BCI DCTMs is provided, which makes this connection feasible. As a result, the proposed BCI DCTMs can be connected without limitations to any detailed model of heat transfer problems and/or to any other MOR-based BCI DCTM.

[1]  Sang-Woong Yoon.  Static and Dynamic Error Vector Magnitude Behavior of 2.4-GHz Power Amplifier , 2007, IEEE Transactions on Microwave Theory and Techniques.

[2]  Takashi Hikihara,et al.  Thermal instability effects in SiC Power MOSFETs , 2012, Microelectron. Reliab..

[3]  Alessandro Magnani,et al.  Fast Nonlinear Dynamic Compact Thermal Modeling With Multiple Heat Sources in Ultra-Thin Chip Stacking Technology , 2017, IEEE Transactions on Components, Packaging and Manufacturing Technology.

[4]  Andrea Irace,et al.  Circuit-Based Electrothermal Simulation of Power Devices by an Ultrafast Nonlinear MOR Approach , 2016, IEEE Transactions on Power Electronics.

[5]  Yousef Saad,et al.  Iterative methods for sparse linear systems , 2003 .

[6]  D. L. Blackburn,et al.  Simulating the dynamic electrothermal behavior of power electronic circuits and systems , 1993 .

[7]  M. Coppola,et al.  On-Line Junction Temperature Monitoring of Switching Devices with Dynamic Compact Thermal Models Extracted with Model Order Reduction , 2017 .

[8]  L. Codecasa,et al.  Compact Models of Dynamic Thermal Networks with Many Heat Sources , 2007, IEEE Transactions on Components and Packaging Technologies.

[9]  W. P. Jones,et al.  Analysis of the cell-centred finite volume method for the diffusion equation , 2000 .

[10]  M. Rencz,et al.  A Methodology for the Co-Simulation of Dynamic Compact Models of Packages With the Detailed Models of Boards , 2007, IEEE Transactions on Components and Packaging Technologies.

[11]  Alessandro Magnani,et al.  Structure-preserving approach to multi-port dynamic compact models of nonlinear heat conduction , 2015, Microelectron. J..

[12]  W. Meeker.  Accelerated Testing: Statistical Models, Test Plans, and Data Analyses , 1991 .

[13]  Lorenzo Codecasa,et al.  Compact electro-thermal models of interconnects , 2013, 19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).

[14]  Wei Wei,et al.  Self-heating and memory effects in RF power amplifiers explained through electro-thermal , 2013, 2013 NORCHIP.

[15]  Alessandro Magnani,et al.  Fast novel thermal analysis simulation tool for integrated circuits (FANTASTIC) , 2014, 20th International Workshop on Thermal Investigations of ICs and Systems.

[16]  M.-N. Sabry,et al.  Dynamic Compact Thermal Models Used for Electronic Design: A Review of Recent Progress , 2003 .

[17]  Clemens J. M. Lasance,et al.  Ten Years of Boundary-Condition- Independent Compact Thermal Modeling of Electronic Parts: A Review , 2008 .

[18]  M. Schroter,et al.  Modeling thermal resistance in trench-isolated bipolar technologies including trench heat flow , 2002 .

[19]  M. Rencz,et al.  Thermal Measurement and Modeling of Multi-Die Packages , 2006, IEEE Transactions on Components and Packaging Technologies.

[20]  M. Stecher,et al.  Electrothermal Simulation of Self-Heating in DMOS Transistors up to Thermal Runaway , 2013, IEEE Transactions on Electron Devices.

[21]  Dawei Xiang,et al.  An Industry-Based Survey of Reliability in Power Electronic Converters , 2011, IEEE Transactions on Industry Applications.

[22]  B. Vijayakumar,et al.  Device and package level thermal modeling of GaAs Power Amplifiers , 2004, The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543).

[23]  Alessandro Magnani,et al.  Matrix reduction tool for creating boundary condition independent dynamic compact thermal models , 2015, 2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).

[24]  Alessandro Magnani,et al.  Calibration of detailed thermal models by parametric dynamic compact thermal models , 2016, 2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).

[25]  Jih-Sheng Lai,et al.  3-D Thermal Component Model for Electrothermal Analysis of Multichip Power Modules With Experimental Validation , 2015, IEEE Transactions on Power Electronics.

[26]  Riko Radojcic,et al.  More-than-Moore 2.5D and 3D SiP Integration , 2017 .

[27]  Nicolas Ginot,et al.  Lumped Dynamic Electrothermal Model of IGBT Module of Inverters , 2015, IEEE Transactions on Components, Packaging and Manufacturing Technology.

[28]  J. Marek,et al.  3-D device and circuit electrothermal simulations of power integrated circuit including package , 2016, 2016 11th International Conference on Advanced Semiconductor Devices & Microsystems (ASDAM).

[29]  Paolo Maffezzoni,et al.  Compact modeling of electrical devices for electrothermal analysis , 2003 .

[30]  C. M. Johnson,et al.  Automated Fast Extraction of Compact Thermal Models for Power Electronic Modules , 2013, IEEE Transactions on Power Electronics.

[31]  Vincenzo d'Alessandro,et al.  Influence of Scaling and Emitter Layout on the Thermal Behavior of Toward-THz SiGe:C HBTs , 2014, IEEE Transactions on Electron Devices.

[32]  Lorenzo Codecasa,et al.  Compact thermal models for stochastic thermal analysis , 2014, Microelectron. J..

[33]  Lorenzo Codecasa,et al.  Novel approach to compact modeling for nonlinear thermal conduction problems , 2013, 19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).

[34]  Daniel Lu,et al.  Materials for Advanced Packaging , 2008 .

[35]  Peter Tavner,et al.  Condition Monitoring for Device Reliability in Power Electronic Converters: A Review , 2010, IEEE Transactions on Power Electronics.

[36]  S. Nelson,et al.  Current gain collapse in microwave multifinger heterojunction bipolar transistors operated at very high power densities , 1993 .

[37]  V. d'Alessandro,et al.  Novel MOR approach for extracting dynamic compact thermal models with massive numbers of heat sources , 2016, 2016 32nd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM).

[38]  Alessandro Magnani,et al.  Simulation comparison of InGaP/GaAs HBT thermal performance in wire-bonding and flip-chip technologies , 2017, Microelectron. Reliab..

[39]  Sachin S. Sapatnekar,et al.  Thermally Aware Design , 2008, Found. Trends Electron. Des. Autom..

[40]  L. Codecasa,et al.  Why matrix reduction is better than objective function based optimization in compact thermal model creation , 2015, 2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).

[41]  P. Guerriero,et al.  Thermal feedback blocks for fast and reliable electrothermal circuit simulation of power circuits at module level , 2016, 2016 28th International Symposium on Power Semiconductor Devices and ICs (ISPSD).

[42]  Alessandro Magnani,et al.  Structure preserving approach to parametric dynamic compact thermal models of nonlinear heat conduction , 2015, 2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).

[43]  Alessandro Magnani,et al.  Parametric compact thermal models by moment matching for variable geometry , 2014, 20th International Workshop on Thermal Investigations of ICs and Systems.

[44]  Paolo Maffezzoni,et al.  An Arnoldi based thermal network reduction method for electro-thermal analysis , 2003 .

[45]  Lorenzo Codecasa.  Nonlinear dynamic compact thermal models by structure-preserving projection , 2014, Microelectron. J..

[46]  Alessandro Magnani,et al.  Novel partition-based approach to dynamic compact thermal modeling , 2016, 2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).

[47]  V. d'Alessandro,et al.  Analysis of the Influence of Layout and Technology Parameters on the Thermal Impedance of GaAs HBT/BiFET Using a Highly-Efficient Tool , 2014, 2014 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS).

[48]  Mauro Ciappa,et al.  Selected failure mechanisms of modern power modules , 2002, Microelectron. Reliab..

[49]  Alessandro Magnani,et al.  Multi-port dynamic compact thermal models of nonlinear heat conduction , 2014, 20th International Workshop on Thermal Investigations of ICs and Systems.

[50]  Lorenzo Codecasa,et al.  Stochastic thermal modeling by polynomial chaos expansion , 2013, 19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).

[51]  Alessandro Magnani,et al.  Compact Dynamic Modeling for Fast Simulation of Nonlinear Heat Conduction in Ultra-Thin Chip Stacking Technology , 2014, IEEE Transactions on Components, Packaging and Manufacturing Technology.

[52]  P. Maffezzoni,et al.  Multipoint moment matching reduction from port responses of dynamic thermal networks , 2005, IEEE Transactions on Components and Packaging Technologies.

[53]  A. Irace,et al.  Experimental Detection and Numerical Validation of Different Failure Mechanisms in IGBTs During Unclamped Inductive Switching , 2013, IEEE Transactions on Electron Devices.

[54]  Stig Munk-Nielsen,et al.  Improving Power Converter Reliability: Online Monitoring of High-Power IGBT Modules , 2014, IEEE Industrial Electronics Magazine.

[55]  D. J. Walkey,et al.  A scalable thermal model for trench isolated bipolar devices , 2000 .

[56]  Attila Geczy,et al.  Package–on–Package – Review on a Promising Packaging Technology , 2010, 33rd International Spring Seminar on Electronics Technology, ISSE 2010.

[57]  L. L. Liou,et al.  Thermal stability analysis of AlGaAs/GaAs heterojunction bipolar transistors with multiple emitter fingers , 1994 .

[58]  Juraj Marek,et al.  Fast 3-D Electrothermal Device/Circuit Simulation of Power Superjunction MOSFET Based on SDevice and HSPICE Interaction , 2014, IEEE Transactions on Electron Devices.

[59]  Kaustav Banerjee,et al.  Modeling and analysis of nonuniform substrate temperature effects on global ULSI interconnects , 2005, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems.