A high-density MIM capacitor (13 fF/μm/sup 2/) using ALD HfO2 dielectrics
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A. Chin | M. Li | Chunxiang Zhu | Byung Jin Cho | Ming Bin Yu | Dim-Lee Kwong | Hang Hu | Xiongfei Yu | P. Foo
[1] Ming-Fu Li,et al. A high performance MIM capacitor using HfO2 dielectrics , 2002, IEEE Electron Device Letters.
[2] A. Chin,et al. High-density MIM capacitors using Al 2 O 3 and AlTiO x dielectrics , 2002 .
[3] J. Liu,et al. High-density MIM capacitors using Al2O3 and AlTiOx dielectrics , 2002, IEEE Electron Device Letters.
[4] S.J. Lee,et al. Performance and reliability of ultra thin CVD HfO/sub 2/ gate dielectrics with dual poly-Si gate electrodes , 2001, 2001 Symposium on VLSI Technology. Digest of Technical Papers (IEEE Cat. No.01 CH37184).
[5] R. Wallace,et al. High-κ gate dielectrics: Current status and materials properties considerations , 2001 .
[6] J. Babcock,et al. Analog characteristics of metal-insulator-metal capacitors using PECVD nitride dielectrics , 2001, IEEE Electron Device Letters.
[7] M. Raymond,et al. Integration of thin film MIM capacitors and resistors into copper metallization based RF-CMOS and Bi-CMOS technologies , 2000, International Electron Devices Meeting 2000. Technical Digest. IEDM (Cat. No.00CH37138).
[8] K. Stein,et al. A high reliability metal insulator metal capacitor for 0.18 /spl mu/m copper technology , 2000, International Electron Devices Meeting 2000. Technical Digest. IEDM (Cat. No.00CH37138).
[9] High density metal insulator metal capacitors using PECVD nitride for mixed signal and RF circuits , 1999, Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat. No.99EX247).