Reliability test methods for media-compatible pressure sensors

Two applications of media exposure testing of pressure sensors with barrier coatings are presented. Experimentation was performed on an apparatus that was developed specifically for the exposure of these devices with in situ output voltage measurement in organic or aqueous environments. The first example illustrates the swelling of fluorosilicone gels in fuels and establishes a solubility parameter for one fluorosilicone gel between 6-8 (cal/cm/sup 3/)/sup 1/2/. While exposure to organic solutions has not been observed to cause catastrophic failure of fluorosilicone-gel-filled devices, corrosion is accelerated in subsequent aqueous solution exposure. An additional experiment was used to simulate automotive exhaust gases and water by exposing devices to a fuel mixture followed by an acidic solution. The second experiment was performed to study corrosion under parylene coatings during exposure to an alkaline test solution for white-goods applications. Acceleration factor expressions have been estimated considering parylene coating thickness, solution pH, and applied device supply voltage as acceleration means. These expressions have been used to evaluate parylene-coated pressure sensors against a benchmark lifetime requirement. For a 1% failure rate, parylene-coated pressure sensors survived approximately 500 h, whereas an alternative, fluorosilicone gel over parylene C coating survived over 2000 h. Furthermore, these media exposure experiments provided insight into the failure mechanisms and defined acceleration factors.

[1]  Eric A. Grulke Solubility Parameter Values , 1999 .

[2]  M. Nese,et al.  Anodic bonding of silicon to silicon wafers coated with aluminium, silicon oxide, polysilicon or silicon nitride , 1993 .

[3]  K. Petersen Mems: What Lies Ahead? , 1995, Proceedings of the International Solid-State Sensors and Actuators Conference - TRANSDUCERS '95.

[4]  W. F. Gorham A New, General Synthetic Method for the Preparation of Linear Poly‐p‐xylylenes , 1966 .

[5]  A. Nakladal,et al.  Influences of humidity and moisture on the long-term stability of piezoresistive pressure sensors , 1995 .

[6]  David J. Monk,et al.  Thin Film Polymer Stress Measurement Using Piezoresistive Anisotropically Etched Pressure Sensors , 1995 .

[7]  H. Leidheiser Mechanisms of De-adhesion of Organic Coatings from Metal Surfaces , 1986 .

[8]  James H. Smith,et al.  CMOS-compatible surface-micromachined pressure sensor for aqueous ultrasonic application , 1995, Smart Structures.

[9]  R. E. Sulouff Silicon sensors for automotive applications , 1991, TRANSDUCERS '91: 1991 International Conference on Solid-State Sensors and Actuators. Digest of Technical Papers.

[10]  A new piezoresistive pressure transducer principle with improvements in media compatibility , 1996 .

[11]  Karsten Dyrbye,et al.  Packaging of physical sensors for aggressive media applications , 1996 .

[12]  Karsten Dyrbye,et al.  Protective coatings in harsh environments , 1996 .

[13]  John Wertz,et al.  Analytical techniques for examining reliability and failure mechanisms of barrier-coated encapsulated silicon pressure sensors exposed to harsh media , 1996, Photonics West - Micro and Nano Fabricated Electromechanical and Optical Components.

[14]  Nichols Mf,et al.  The challenges for hermetic encapsulation of implanted devices ― a review , 1994 .

[15]  K.E. Petersen,et al.  Silicon as a mechanical material , 1982, Proceedings of the IEEE.

[16]  Peter R. Nelson,et al.  Design and Analysis of Experiments, 3rd Ed. , 1991 .

[17]  R. C. Weast CRC Handbook of Chemistry and Physics , 1973 .

[18]  M. Nese,et al.  Silicon-to-silicon anodic bonding with a borosilicate glass layer , 1991 .

[19]  Henrik Jakobsen,et al.  Silicon-to-thin film anodic bonding , 1992 .

[20]  Mike Noble Environmental Concerns for Integrated Circuit Sensors , 1986 .