Monolithic integration of trench vertical DMOS (VDMOS) power transistors into a BCD process

The monolithic integration of trench vertical DMOS (VDMOS) n-channel transistors into an IC BCD process is reported for the first time. The integration scheme for the trench VDMOS module is discussed and silicon results are compared with TCAD simulations. For a 50-V device, the integrated trench device is shown to offer at least a factor-of-two R/sub DS(ON)/ /spl times/ area advantage over its planar counterpart. An R/sub DS(ON)/ /spl times/ area value of 80 m/spl Omega/mm/sup 2/ is achieved for the integrated trench VDMOS using a minimum feature size of 1 /spl mu/m.

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