Inhibitive action of the purine and adenine for copper corrosion in sulphate solutions
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[1] M. Scendo. The effect of purine on the corrosion of copper in chloride solutions , 2007 .
[2] M. Scendo. Corrosion inhibition of copper by potassium ethyl xanthate in acidic chloride solutions , 2005 .
[3] M. Scendo. Potassium ethyl xanthate as corrosion inhibitor for copper in acidic chloride solutions , 2005 .
[4] P. Patil,et al. Corrosion protective poly(o-toluidine) coatings on copper , 2005 .
[5] E. D’Elia,et al. Effect of cysteine on the anodic dissolution of copper in sulfuric acid medium , 2004 .
[6] Giuseppe Quartarone,et al. Inhibition of copper corrosion by isatin in aerated 0.5 M H2SO4 , 2003 .
[7] D. Poddebniak,et al. Indole and 5-chloroindole as inhibitors of anodic dissolution and cathodic deposition of copper in acidic chloride solutions , 2003 .
[8] G. Moretti,et al. Tryptophan as copper corrosion inhibitor in 0.5 M aerated sulfuric acid , 2002 .
[9] H. Takenouti,et al. Protective effect of electropolymerized 3-amino 1,2,4-triazole towards corrosion of copper in 0.5 M NaCl , 2002 .
[10] M. Hepel,et al. Growth Kinetics of Multi-Layer CuEtX Films on Copper Piezoelectrodes , 2002 .
[11] J. Stickney,et al. Thin Films: Preparation, Characterization, Applications , 2002 .
[12] J. Malyszko,et al. The Influence of Benzotriazole and Tolyltriazole on the Copper Electrodeposition on Polycrystalline Platinum from Acidic Chloride Solutions , 2000 .
[13] B. Ramesh Babu,et al. Corrosion and hydrogen permeation inhibition for mild steel in HCl by isomers of organic compounds , 2000 .
[14] H. Baba,et al. Corrosion inhibition and characteristics of the triazinedithiol surface film on copper under potentiostatic anodization , 1999 .
[15] W. Badawy,et al. Electrochemical behaviour and corrosion inhibition of Al, Al-6061 and Al–Cu in neutral aqueous solutions , 1999 .
[16] S. Martinez,et al. Ferric-Tannate Formation and Anticorrosive Properties of Mimosa Tannin in Acidic Solutions , 1999 .
[17] M. Itagaki,et al. Study of dissolution mechanisms of nickel in sulfuric acid solution by electrochemical quartz crystal microbalance , 1997 .
[18] S. Krzewska. Impedance investigation of the mechanism of copper electrodeposition from acidic perchlorate electrolyte , 1997 .
[19] S. Magaino. Corrosion rate of copper rotating-disk-electrode in simulated acid rain , 1997 .
[20] T. Gu,et al. Effect of metallic cations on corrosion inhibition of an anionic surfactant for mild steel , 1996 .
[21] R. Coudert,et al. Some Nonionic Surfactants as Inhibitors of the Corrosion of Iron in Acid Chloride Solutions , 1996 .
[22] Alan R. Katritzky,et al. Comprehensive Heterocyclic Chemistry IV , 1996 .
[23] Howard W. Pickering,et al. Application of a quartz crystal microbalance to the study of copper corrosion in acid solution inhibited by triazole-iodide protective films , 1995 .
[24] M. H. Wahdan,et al. Effect of temperature on the acidic dissolution of copper in the presence of amino acids , 1994 .
[25] K. Nobe,et al. Rotating ring-disk electrode studies of Cu-Zn alloy electrodissolution in 1M HCl , 1993 .
[26] D. Macfarlane,et al. A kinetic model for the dissolution mechanism of copper in acidic sulfate solutions , 1993 .
[27] D. Allara,et al. Effect of KI on Improving Copper Corrosion Inhibition Efficiency of Benzotriazole in Sulfuric Acid Electrolytes , 1993 .
[28] S. Bilgiç,et al. Effect of amino acids on corrosion of cobalt in H2SO4 , 1993 .
[29] D. Tromans,et al. Anodic Behavior of Copper in Weakly Alkaline Solutions , 1992 .
[30] S. Bilgiç,et al. The effect of amino acids on the corrosion of nickel in H2SO4 , 1992 .
[31] C. Leygraf,et al. Quartz crystal microbalance applied to studies of atmospheric corrosion of metals , 1992 .
[32] M. Pritzker,et al. Morphological stability of a planar metal electrode during potentiostatic electrodeposition and electrodissolution , 1992 .
[33] P. Fricoteaux,et al. Electrodeposition and electrodissolution of copper with a magnetic field: dynamic and stationary investigations , 1991 .
[34] R. Alkire,et al. Effect of Benzotriazole on Surface Processes during Copper Electrodissolution in Sulfuric Acid , 1991 .
[35] M. Scendo,et al. The stepwise reduction of Cu(II) at a platinum electrode in water + N,N-dimethylformamide mixtures , 1989 .
[36] R. Alkire,et al. Effect of Benzotriazole on Dissolution of Copper in the Presence of Fluid Flow: I. Experimental , 1989 .
[37] J. Malyszko,et al. Electrode kinetics of the Cu(II)/Cu(I) system at platinum in water + dimethylsulphoxide (DMSO) mixtures , 1988 .
[38] J. Malyszko,et al. Redox equilibria in the Cu2+-Cu+-Cu system in water-dimethylsulphoxide (DMSO) mixtures , 1987 .
[39] G. W. Walter,et al. A review of impedance plot methods used for corrosion performance analysis of painted metals , 1986 .
[40] H. Rother,et al. Inhibierung von wässerigen und alkoholisch wässerigen Wärmeträgern , 1981 .
[41] S. Sharma. Reaction of Copper and Copper Oxide with H 2 S , 1980 .
[42] G. Poling,et al. Protection of Copper by Pretreatment with Benzotriazole , 1979 .
[43] J. A. Harrison,et al. The deposition of copper , 1975 .
[44] R. Walker,et al. Benzotriazole as a Corrosion Inhibitor for Immersed Copper , 1973 .
[45] J. Bockris,et al. Galvanostatic studies of the kinetics of deposition and dissolution in the copper + copper sulphate system , 1959 .