반도체 공정의 트랙모니터링 분석에 관한 연구

A track system composed of in-line types is mainly used to perform a photo process that is the core process in semiconductor processes. In order to monitor track system in manufacturing process, Manufacturing Execution System (MES) is extensively adopted to record monitoring data from track system. Critical Dimension (CD) deviation and pattern loss frequently happen from oven processes due to location error of wafer during the photo process. However, current monitoring methods are limited to check the location of wafer during the process. In the research, we suggest a new analysis method to reduce process error due to the location error of wafer by using MES temperature monitoring data.