Discrete element method (DEM) modeling of fracture and damage in the machining process of polycrystalline SiC

Discrete element method (DEM) was employed in the research works presented in this paper to simulate the microscopic machining process of ceramics. A densely packed particle assembly system of the polycrystalline SiC has been generated in DEM software package PFC2D using bonded-particle model (BPM) in order to represent for the ceramic part numerically. Microscopic mechanical properties of SiC were calibrated by comparing the numerical tests in PFC2D with the equivalent experimental results, and introduced into the subsequent modeling of the ceramic machining process. The dynamic process of initiation and propagation of the micro-cracks under various machining conditions has been explicitly modeled in the DEM simulations. The numerical results from DEM modeling agreed well with the experimental observations and theoretical predictions. Rational relations between cracking damage of ceramics and cutting conditions have been established based on the analysis of simulation results. A generalized model of defining the range of inelastic zone has also been developed based on the numerical results. Moreover, this study has demonstrated the advantage of DEM model in its capability of revealing the mechanical details of machining process at micro-scale.

[1]  Xuesong Han,et al.  Study micromechanism of surface planarization in the polishing technology using numerical simulation method , 2007 .

[2]  H. Zheng,et al.  Study on Mechanism of Ceramics Grinding , 1992 .

[3]  Joseph F Labuz,et al.  SIMULATION OF FAILURE AROUND A CIRCULAR OPENING IN ROCK , 2002 .

[4]  P. Cundall,et al.  A discrete numerical model for granular assemblies , 1979 .

[5]  Colin Thornton,et al.  Numerical studies of uniaxial powder compaction process by 3D DEM , 2004 .

[6]  Zdenek P. Bazant,et al.  Scaling of Structural Failure , 1997 .

[7]  S. P. Hunt,et al.  Modelling the Kaiser effect and deformation rate analysis in sandstone using the discrete element method , 2003 .

[8]  Said Jahanmir,et al.  Finite element simulation of straight plunge grinding for advanced ceramics , 2003 .

[9]  J. Patten,et al.  Ductile to brittle transition depths for CVD silicon carbide and quartz , 2007 .

[10]  Y. Liu,et al.  Experimental investigations of machining characteristics and removal mechanisms of advanced ceramics in high speed deep grinding , 2003 .

[11]  Bi Zhang,et al.  Grinding Damage Prediction for Ceramics via CDM Model , 2000 .

[12]  Shyam Bahadur,et al.  Material removal and subsurface damage studies in dry and lubricated single-point scratch tests on alumina and silicon nitride , 1999 .

[13]  J. Patten,et al.  Ductile Regime Nanomachining of Single-Crystal Silicon Carbide , 2005 .

[14]  Luis E. Vallejo,et al.  DEM analysis of crushing around driven piles in granular materials , 2005 .

[15]  Fengzhou Fang,et al.  Nanometric cutting of copper: A molecular dynamics study , 2006 .

[16]  Rui Zhang,et al.  Simulation on mechanical behavior of cohesive soil by Distinct Element Method , 2006 .

[17]  W. Kanematsu.  Subsurface damage in scratch testing of silicon nitride , 2004 .

[18]  F. Donze,et al.  Discrete element modelling of concrete submitted to dynamic loading at high strain rates , 2004 .

[19]  Idar Larsen,et al.  Comparison between controlled laboratory experiments and discrete particle simulations of the mechanical behaviour of rock , 2005 .

[20]  A. Evans,et al.  Elastic/Plastic Indentation Damage in Ceramics: The Median/Radial Crack System , 1980 .

[21]  G. Subhash,et al.  A New Scratch Resistance Measure for Structural Ceramics , 2005 .

[22]  J. Patten.  High Pressure Phase Transformation Analysis and Molecular Dynamics Simulations of Single Point Diamond Turning of Germanium. , 1996 .

[23]  M. B. Cai,et al.  Study of the mechanism of nanoscale ductile mode cutting of silicon using molecular dynamics simulation , 2007 .

[24]  Anna Pandolfi,et al.  Numerical investigation on the dynamic behavior of advanced ceramics , 2004 .

[25]  D. Potyondy.  Simulating stress corrosion with a bonded-particle model for rock , 2007 .

[26]  P. Cundall,et al.  A bonded-particle model for rock , 2004 .

[27]  R. G. Jasinevicius.  Influence of cutting conditions scaling in the machining of semiconductors crystals with single point diamond tool , 2006 .

[28]  I. Hutchings,et al.  Correlations between tangential force and damage mechanisms in the scratch testing of ceramics , 1997 .

[29]  Masanori Yoshikawa,et al.  Study on surface cracking of alumina scratched by single-point diamonds , 1988 .