论文信息 - Special Issue on PCB Level Signal Integrity, Power Integrity, and EMC

Special Issue on PCB Level Signal Integrity, Power Integrity, and EMC

The 24 papers in this special issue highlight recent significant advancements and innovations related to printed circuit board (PCB) signal integrity (SI), power integrity (PI), electromagnetic emission and susceptibility modeling, design, and measurement technologies.

Joungho Kim | Er-Ping Li | Joungho Kim | E. Li

[1] Wei-Da Guo,et al. Signal/Power Integrity Modeling of High-Speed Memory Modules Using Chip-Package-Board Coanalysis , 2010, IEEE Transactions on Electromagnetic Compatibility.

[2] Varvara Kollia,et al. A Domain Decomposition Approach for Efficient Electromagnetic Analysis of the Power Distribution Network of Packaged Electronic Systems , 2010, IEEE Transactions on Electromagnetic Compatibility.

[3] Jun Fan,et al. Systematic Microwave Network Analysis for Multilayer Printed Circuit Boards With Vias and Decoupling Capacitors , 2010, IEEE Transactions on Electromagnetic Compatibility.