论文信息 - Effect of Electromagnetic Field on the Solidification Structure of C70250 Copper Alloy

Effect of Electromagnetic Field on the Solidification Structure of C70250 Copper Alloy

The effect of electromagnetic field on the solidification structure of C70250 copper alloy (Cu-3.2%Ni-0.8%Si in mass%) had been investigated in this paper. The results show that applying electromagnetic field during the solidification of C70250 copper alloy can refine as-cast structure and δ-Ni2Si phase. The morphology of δ-Ni2Si phase changes from coarse massive shape to fine dotlike shape. The above-mentioned effects become more obvious with the increasing in current intensity.

B. Li | J. Cui | H. Zhang

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