论文信息 - Cooling management of a protruding electronic components by using a phase change material heat sink

Cooling management of a protruding electronic components by using a phase change material heat sink

The aim of the present work is to study the thermal performance of a hybrid heat sink used for cooling management of protruding substrate-mounted electronic chips. The power generated in electronic chips is dissipated in phase change material (PCM) that filled a rectangular enclosure. The advantage of using this cooling strategy is that the PCMs are able to absorb a high amount of heat generated by IC without operating the fan. A (2D) mathematical model was developed for a heat sink. Several experiment simulations were conducted to analyze the effect of the substrate thermal conductivity on the cooling of the chips.

Mustapha Faraji | Hamid El Qarnia

[1] Chia-Jung Hsu. Numerical Heat Transfer and Fluid Flow , 1981 .

[2] Yogendra Joshi,et al. Application of phase change materials for passive thermal control of plastic quad flat packages (PQFP): a computational study , 1995 .

[3] Yogesh Jaluria,et al. A COMPARISON OF DIFFERENT SOLUTION METHODOLOGIES FOR MELTING AND SOLIDIFICATION PROBLEMS IN ENCLOSURES , 1993 .

[4] J. C. Jaeger,et al. Conduction of Heat in Solids , 1952 .

[5] S. Patankar. Numerical Heat Transfer and Fluid Flow , 2018, Lecture Notes in Mechanical Engineering.

[6] F. L. Tan,et al. Cooling of mobile electronic devices using phase change materials , 2004 .

[7] Frank P. Incropera,et al. Liquid Cooling of Electronic Devices by Single-Phase Convection , 1999 .

[8] M. Cross,et al. An enthalpy method for convection/diffusion phase change , 1987 .

[9] Arun S. Mujumdar,et al. Application of phase change materials in thermal management of electronics , 2007 .

[10] D. Pal,et al. Application of phase change materials for passive thermal control of plastic quad flat packages (PQFP): a computational study , 1995, Proceedings of 1995 IEEE/CPMT 11th Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM).

[11] Roshan Jeet Jee Jachuck,et al. Integrated thermal management techniques for high power electronic devices , 2004 .