Creep damage study at powercycling of lead-free surface mount device

[1]  Chi‐Man Lawrence Wu,et al.  Properties of lead-free solder alloys with rare earth element additions , 2004 .

[2]  A. Syed.  Accumulated creep strain and energy density based thermal fatigue life prediction models for SnAgCu solder joints , 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

[3]  G. Subbarayan,et al.  Powercycling Reliability, Failure Analysis and Acceleration Factors of Pb-Free Solder Joints , 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..

[4]  Yong Liu,et al.  Experimental Determination and Modification of Anand Model Constants for Pb-Free Material 95.5Sn4.0Ag0.5Cu , 2007, 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007.

[5]  V. Silberschmidt,et al.  Finite element analysis of lead-free surface mount devices , 2008 .