论文信息 - Application of Directed Self‐Assembly Lithography to Semiconductor Device Manufacturing Process

Application of Directed Self‐Assembly Lithography to Semiconductor Device Manufacturing Process

SUMMARY Directed self-assembly (DSA) lithography has recently entered the spotlight as one of the most promising new generation lithography candidates, with the potential for fabrication of semiconductor device patterns down to sub-30 nm. In this report, the latest experimental and simulation results on the contact hole shrinking process using DSA are demonstrated.

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