Advanced Embedded Packaging for Power Devices

Power electronics has a great popularity in many industrial fields. Recently, in automotive industrial fields, the number of demand on electrical vehicles has been extremely rising. Those devices are required to have high thermal performance. However, conventional power device packages using wire are difficult to match that. So we have developed a new and expectable advanced package for power devices using embedded dies and RDL. We conformed that our package has a low electrical resistance and good thermal performance due to the heat dissipation through many via holes. To fabricate test vehicle, we designed process parameters around via structure particularly. We fixed aspect ratio concerning copper-filling plating, and DAF material for enough adhesion. And then we actually fabricated TV sample embedded TEG chip and live-die, and realized the via structure is completely filled and connected correctly by the simple I-V curve on this package. We are expecting this package to be promising for the future power devices with good thermal performance.