论文信息 - A Back Illuminated 10μm SPAD Pixel Array Comprising Full Trench Isolation and Cu-Cu Bonding with Over 14% PDE at 940nm - 字舞流文

A Back Illuminated 10μm SPAD Pixel Array Comprising Full Trench Isolation and Cu-Cu Bonding with Over 14% PDE at 940nm

K. Tatani | H. Nakayama | J. Yamamoto | R. Naito | K. Ito | Y. Otake | Y. Kitano | A. Matsumoto | T. Ogasahara | H. Hiyama | K. Takeuchi | T. Tada | K. Takabayashi | T. Hirano | T. Wakano