论文信息 - Synergistic combinations of dielectrics and metallization process technology to achieve 22nm interconnect performance targets - 字舞流文

Synergistic combinations of dielectrics and metallization process technology to achieve 22nm interconnect performance targets

Tom Mountsier | Roey Shaviv | E. Soda | Terry A. Spooner | Girish Dixit | M. Tagami | Eric G. Liniger | James J. Demarest | G. A. Antonelli | F. Baumann | F. Baumann | J. Demarest | T. Spooner | E. Liniger | G. Dixit | S. Cohen | H. Shobha | S. Cohen | T. Mountsier | Gengwei Jiang | M. Tagami | Hosadurga Shobha | George Andrew Antonelli | K. J. Park | I. Karim | Wen Wu | O. Vander Straten | G. Jiang | G. Jiang | E. Soda | K. J. Park | R. Shaviv | I. Karim | Wen Wu | O. Straten | G. Antonelli | W. Wu

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