Control of electron velocity distributions at the wafer by tailored voltage waveforms in capacitively coupled plasmas to compensate surface charging in high-aspect ratio etch features
暂无分享,去创建一个
P. Hartmann | R. Brinkmann | J. Schulze | S. Wilczek | Z. Donkó | T. Mussenbrock | A. Derzsi | Z. Juhász | L. Wang | B. Berger | Eunwoo Lee | K. Nösges