Cavity models of planar components grounded by via-holes and their experimental verification

Semianalytical electromagnetic models of grounding via-holes and shorted resonators of different shapes are proposed and experimentally verified. Our models are based on the cavity approach previously used for circular-pad via-holes. For the first time, a model of a square-pad via-hole is developed. By a perturbation approach, an approximate model for slightly rectangular shorted patches is also derived. All our via-hole models are verified experimentally. The influence of the technologically caused eccentricity of the via-hole shape is also modeled and studied by measurements. Additional verification is done by full-wave simulations with Agilent Momentum (2002) and IE3D-10.1. Our models compute the modal resonant frequencies, fields, and equivalent-circuit components of the via-holes. They allow for the study of the frequency limitations of grounding via-holes for high-speed applications, as well as the modes of shorted resonators for printed antennas and filters. The developed models are fast and accurate.

[1]  A. Derneryd,et al.  Analysis of the microstrip disk antenna element , 1979 .

[2]  M. Deen,et al.  Influence of eccentricity on the frequency limitations of circular-pad via-holes , 2004, IEEE Microwave and Wireless Components Letters.

[3]  R. Waterhouse,et al.  Performance of microstrip patches incorporating a single shorting post , 1996, IEEE Antennas and Propagation Society International Symposium. 1996 Digest.

[4]  Leonard W. Schaper,et al.  Modeling of Integrated Inductors and Resistors for Microwave Applications , 2003 .

[5]  A. K. Bhattacharyya.  Characteristics of space and surface waves in a multilayered structure (microstrip antennas) , 1990 .

[6]  T. Larsen.  On the Relation Between Modes in Rectangular, Elliptical, and Parabolic Waveguides and a Mode-Classifying System , 1972 .

[7]  大越 孝敬.  Planar circuits for microwaves and lightwaves , 1985 .

[8]  Zhizhang Chen,et al.  On resonant effects in multilayer RF/microwave printed circuit board applications , 1999, ECTC 1999.

[9]  A. Andronov,et al.  Qualitative Theory of Second-order Dynamic Systems , 1973 .

[10]  J. Roumeliotis,et al.  Cutoff frequencies of eccentric circular-elliptic metallic waveguides , 1994 .

[11]  Zhongyou Yan.  A microstrip patch resonator with a via connecting ground plane , 2002 .

[12]  R. Vaughan.  Two-port higher mode circular microstrip antennas , 1988 .

[13]  M.J. Deen,et al.  Circular-pad via model based on cavity field analysis , 2003, IEEE Microwave and Wireless Components Letters.

[14]  Said F. Al-Sarawi,et al.  A Review of 3-D Packaging Technology , 1998 .

[15]  John H. Lau,et al.  Microvias: For Low Cost, High Density Interconnects , 2001 .

[16]  Roberto Sorrentino,et al.  Advanced Modal Analysis: CAD Techniques for Waveguide Components and Filter , 1999 .

[17]  V. I. Gvozdev,et al.  NEW INSTRUMENTS AND METHODS OF INVESTIGATIONS Physical principles of the modeling of three-dimensional microwave and extremely high frequency integrated circuits , 1992 .

[18]  William E. McKinzie,et al.  Design methodology for Sievenpiper high-impedance surfaces: an artificial magnetic conductor for positive gain electrically small antennas , 2003 .

[19]  C. Y. Wang,et al.  Frequencies of a truncated circular waveguide-method of internal matching , 2000 .