Influence of Miniaturization on Mechanical Reliability of Lead‐Free Solder Interconnects

[1]  Jiemin Zhou,et al.  Size effects of lead-free solder joint thickness under shear creep based on micro-electrical-resistance strain , 2008 .

[2]  Robert Darveaux,et al.  Solder Joint Fatigue Life Model , 1997 .

[3]  R. Darveaux,et al.  Effect of joint size and pad metallization on solder mechanical properties , 2008, 2008 58th Electronic Components and Technology Conference.

[4]  C. R. Barrett,et al.  Deformation and failure of brazed joints—macroscopic considerations , 1971 .

[5]  Guna S Selvaduray,et al.  Solder joint fatigue models: review and applicability to chip scale packages , 2000 .

[6]  Tomi Laurila,et al.  Interfacial reactions between lead-free solders and common base materials , 2005 .

[7]  E. Arzt.  Size effects in materials due to microstructural and dimensional constraints: a comparative review , 1998 .

[8]  Cemal Basaran,et al.  A thermodynamics based damage mechanics constitutive model for low cycle fatigue analysis of microelectronics solder joints incorporating size effects , 2005 .

[9]  Yiping Wu,et al.  Effect of stand-off height on the reliability of Cu/Sn-4.8Bi-2Ag/Cu solder joint , 2009, 2009 International Conference on Electronic Packaging Technology & High Density Packaging.

[10]  P. Conway,et al.  Formation of Sn dendrites and SnAg eutectics in a SnAgCu solder , 2009 .

[11]  Nikhilesh Chawla,et al.  An evaluation of the lap-shear test for Sn-rich solder/Cu couples: Experiments and simulation , 2004 .

[12]  Nikhilesh Chawla,et al.  Deformation analysis of lap-shear testing of solder joints , 2005 .

[13]  Jasbir Bath,et al.  Lead-Free Soldering , 2007 .

[14]  Mike Roellig,et al.  The Effect of Downscaling the Dimensions of Solder Interconnects on their Creep Properties , 2007, 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007.

[15]  P. Conway,et al.  Reliability issues in Pb-free solder joint miniaturization , 2006 .

[16]  G. J. Davies,et al.  Theoretical and experimental interlayered butt joints tested in tension , 1983 .

[17]  Johan Liu,et al.  Comparison of isothermal mechanical fatigue properties of lead free solder joints and bulk solders , 2005, Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003..

[18]  P. Conway,et al.  Grain features of SnAgCu solder and their effect on mechanical behaviour of micro-joints , 2006, 56th Electronic Components and Technology Conference 2006.

[19]  R. S. Sidhu,et al.  Microstructure Characterization and Creep Behavior of Pb-Free Sn-Rich Solder Alloys: Part I. Microstructure Characterization of Bulk Solder and Solder/Copper Joints , 2008 .

[20]  J. W. Morris,et al.  Effects of cooling rate on mechanical properties of near-eutectic tin-lead solder joints , 1991 .

[21]  W. J. Plumbridge,et al.  Structural integrity in electronics , 2004 .

[22]  H. Ipser,et al.  Size effects in small scaled lead-free solder joints , 2008 .

[23]  M. Dusek,et al.  Low Cycle Isothermal Fatigue Properties of Lead-free Solders , 2007, 2007 9th Electronics Packaging Technology Conference.

[24]  L. Lehman,et al.  Effect of sample size on the solidification temperature and microstructure of SnAgCu near eutectic alloys , 2005 .

[25]  K. Tu,et al.  Six cases of reliability study of Pb-free solder joints in electronic packaging technology , 2002 .

[26]  M. Dusek,et al.  Test approach to isothermal fatigue measurements for lead-free solders. , 2006 .

[27]  Yiping Wu,et al.  Effect of Stand-Off Height on Microstructure and Tensile Strength of the Cu/Sn9Zn/Cu Solder Joint , 2009, 2008 10th Electronics Packaging Technology Conference.

[28]  B. Moran,et al.  Creep, stress relaxation, and plastic deformation in Sn-Ag and Sn-Zn eutectic solders , 1997 .

[29]  B. Weiss,et al.  Constraining Effects of Lead-Free Solder Joints During Stress Relaxation , 2009 .

[30]  K. Takeshita,et al.  A novel approach for predicting the tensile strength of brazed joints , 1998 .

[31]  Joël Cugnoni,et al.  Experimental and numerical studies on size and constraining effects in lead-free solder joints , 2007 .

[32]  J. A. Augis,et al.  A comprehensive surface mount reliability model (CSMR) covering several generations of packaging and assembly technology , 1993 .

[33]  X. P. Zhang,et al.  Size and Volume Effects on the Strength of Microscale Lead-Free Solder Joints , 2009 .

[34]  R. Vinci,et al.  Measuring the mechanical properties of Pb-free solder and Sn-based intermetallics by nanoindentation , 2003 .

[35]  K. N. Subramanian,et al.  Stress relaxation behavior of composite and eutectic Sn-Ag solder joints , 2001 .

[36]  Chris Bailey,et al.  Fracture mechanics analysis of solder joint intermetallic compounds in shear test , 2009 .

[37]  C. Kao,et al.  Massive Spalling of Intermetallics in Solder Joints: a General Phenomenon that Can Occur in Multiple Solder-Substrate Systems , 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

[38]  N. Fleck,et al.  Fracture of a ductile layer constrained by stiff substrates , 2001 .

[39]  C. Tan,et al.  INTERFACE FRACTURE TOUGHNESS ASSESSMENT OF SOLDER JOINTS USING DOUBLE CANTILEVER BEAM TEST , 2010 .

[40]  D. W. Henderson,et al.  Quantitative metallography of β-Sn dendrites in Sn-3.8Ag-0.7Cu ball grid array solder balls via electron backscatter diffraction and polarized light microscopy , 2004 .

[41]  I. Noyan,et al.  Deformation inhomogeneity and representative volume in Pb/Sn solder alloys , 1992 .

[42]  Weigang Zhang,et al.  Effect of Interfacial IMCs Proportion on the Reliability of Miniature Lead-Free Solder Joint , 2006, 2006 7th International Conference on Electronic Packaging Technology.

[43]  Fengshun Wu,et al.  Effect of stand‐off height on the microstructure and mechanical behaviour of solder joints , 2010 .

[44]  Rachel C. Thomson,et al.  Microstructural Considerations for Ultrafine Lead Free Solder Joints , 2006, EuroSime 2006 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems.

[45]  H. Solomon.  Fatigue of 60/40 Solder , 1986 .

[46]  K. S. Kim,et al.  Effects of cooling speed on microstructure and tensile properties of Sn–Ag–Cu alloys , 2002 .

[47]  S. Wiese,et al.  The Dependence of Composition, Cooling Rate and Size on the Solidification Behaviour of SnAgCu Solders , 2007, 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007.

[48]  R. S. Sidhu,et al.  Microstructure Characterization and Creep Behavior of Pb-Free Sn-Rich Solder Alloys: Part II. Creep Behavior of Bulk Solder and Solder/Copper Joints , 2008 .

[49]  R. A. Fournelle,et al.  Microstructural Investigation of Sn‐Ag and Sn‐Ag Solder Joints* , 1997 .

[50]  P. Conway,et al.  Effect of solder bump geometry on the microstructure of Sn–3.5 wt% Ag on electroless nickel immersion gold during solder dipping , 2005 .

[51]  John P. Ranieri,et al.  Plastic constraint of large aspect ratio solder joints , 1995 .

[52]  Hwa-Teng Lee,et al.  Influence of interfacial intermetallic compound on fracture behavior of solder joints , 2003 .

[53]  Brigitte Weiss,et al.  Mechanical Size Effects in Miniaturized Lead-Free Solder Joints , 2008 .