3D heterogeneous sensor system on a chip for defense and security applications

This paper describes a new concept for ultra-small, ultra-compact, unattended multi-phenomenological sensor systems for rapid deployment, with integrated classification-and-decision-information extraction capability from a sensed environment. We discuss a unique approach, namely a 3-D Heterogeneous System on a Chip (HSoC) in order to achieve a minimum 10X reduction in weight, volume, and power and a 10X or greater increase in capability and reliability -- over the alternative planar approaches. These gains will accrue from (a) the avoidance of long on-chip interconnects and chip-to-chip bonding wires, and (b) the cohabitation of sensors, preprocessing analog circuitry, digital logic and signal processing, and RF devices in the same compact volume. A specific scenario is discussed in detail wherein a set of four types of sensors, namely an array of acoustic and seismic sensors, an active pixel sensor array, and an uncooled IR imaging array are placed on a common sensor plane. The other planes include an analog plane consisting of transductors and A/D converters. The digital processing planes provide the necessary processing and intelligence capability. The remaining planes provide for wireless communications/networking capability. When appropriate, this processing and decision-making will be accomplished on a collaborative basis among the distributed sensor nodes through a wireless network.