论文信息 - DPL performance analysis strategy with conventional workflow

DPL performance analysis strategy with conventional workflow

DPL (Double Patterning Lithography) has been in public as one of candidates for 45nm or 32nm HP since ITRS2006update disclosed. A lot of report of the performances and issues regarding to DPL were published. The current main concerns are evaluation of the infrastructures such as decomposition software, advanced photomasks, higher-NA exposure tool and leading-edge hard-mask process. If there is simpler procedure to evaluate DPL using a conventional environment without hard-mask process, the development of DPL will be accelerated. Here, the simple evaluation procedure for DPL using actual photomasks combining double exposure technique was proposed. The pseudo DPL result in terms of mask CD uniformity, image placement and overlay were demonstrated. In this evaluation procedure, decomposition restriction, mask latitude and fabrication load were also discussed

[1] Yasutaka Morikawa,et al. Pattern decomposition for double patterning from photomask viewpoint , 2007, SPIE Advanced Lithography.

[2] Patrick Jaenen,et al. Pitch doubling through dual-patterning lithography challenges in integration and litho budgets , 2007, SPIE Advanced Lithography.

[3] Robert John Socha,et al. Automatic pitch decomposition for improved process window when printing dense features at k1eff<0.20 , 2006, Photomask Japan.