Reduction in Reflections and Ground Bounce for Signal Line Over Slotted Power Plane Using Differential Coupled Microstrip Lines

This paper investigates the noise reduction in the slot-induced ground bounce noise by using differential signaling. An efficient 2-D finite-difference time-domain method together with equivalent circuits for both the differential line and the slot is established and simulations are performed for a three-layer structure to characterize the ground bounce coupling. A simple model is then proposed to understand how the differential coupled microstrip lines can help reduce ground bounce. Different factors which affect noise reduction are investigated, such as the coupling coefficient, rising time, skew of differential signaling, and structure asymmetry in slotline. An experimental setup is devised to demonstrate the noise coupling between signal lines due to the slot-induced ground bounce and significant noise reduction by employing differential signaling. A favorable comparison between the simulation and measured results validates the proposed equivalent circuit model and analysis approach.

[1]  Jose E. Schutt-Aine.  Time-domain characterization of coupled microstrip lines , 1992 .

[2]  L. D. Smith.  Decoupling capacitor calculations for CMOS circuits , 1994, Proceedings of 1994 IEEE Electrical Performance of Electronic Packaging.

[3]  Vaibhav Tripathi,et al.  FDTD simulation of power/ground bounce and crosstalk in IC packages , 1996 .

[4]  H. Merkelo,et al.  Signal integrity issues at split ground and power planes , 1996, 1996 Proceedings 46th Electronic Components and Technology Conference.

[5]  Y. Ko,et al.  Electromagnetic radiation properties of a printed circuit board with a slot in the ground plane , 1999, 1999 International Symposium on Electromagnetic Compatibility (IEEE Cat. No.99EX147).

[6]  B. J. Rubin,et al.  Distributed effects of a gap in power/ground planes , 1999, IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412).

[7]  L. O. Hoeft,et al.  EMI common-mode current dependence on delay skew imbalance in high speed differential transmission lines operating at 1 gigabit/second data rates , 2000, Proceedings IEEE 2000 First International Symposium on Quality Electronic Design (Cat. No. PR00525).

[8]  N. Matsui,et al.  Signal propagation and radiation of single and differential microstrip traces over split image planes , 2000, IEEE International Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.00CH37016).

[9]  Stephen H. Hall,et al.  High-Speed Digital System Design: A Handbook of Interconnect Theory and Design Practices , 2000 .

[10]  F. Gisin,et al.  Routing differential I/O signals across split ground planes at the connector for EMI control , 2000, IEEE International Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.00CH37016).

[11]  Jamil Kawa,et al.  Modeling and analysis of differential signaling for minimizing inductive cross-talk , 2001, DAC '01.

[12]  J. R. Miller.  The impact of split power planes on package performance , 2001, 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).

[13]  Ruey-Beei Wu,et al.  Composite effects of reflections and ground bounce for signal line through a split power plane , 2001 .

[14]  P. Ilavarasan,et al.  Experimental and simulation analysis of single and differential signals changing layers , 2001, 2001 IEEE EMC International Symposium. Symposium Record. International Symposium on Electromagnetic Compatibility (Cat. No.01CH37161).

[15]  Y. Massoud,et al.  Modeling and analysis of differential signaling for minimizing inductive crosstalk , 2001, Proceedings of the 38th Design Automation Conference (IEEE Cat. No.01CH37232).

[16]  S. A. Bokhari.  Radiation from differential printed traces , 2001, 2001 IEEE EMC International Symposium. Symposium Record. International Symposium on Electromagnetic Compatibility (Cat. No.01CH37161).

[17]  P. Ilavarasan,et al.  Simulation/experimental analysis of single/differential signals crossing splits , 2001, 2001 IEEE EMC International Symposium. Symposium Record. International Symposium on Electromagnetic Compatibility (Cat. No.01CH37161).

[18]  James L. Drewniak,et al.  The effects of via transitions on differential signals , 2001, IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565).

[19]  Melinda Piket-May,et al.  The impact of a nonideal return path on differential signal integrity , 2002 .

[20]  L. L. Wai,et al.  Mixed-mode S-parameter characterization of differential structures , 2003, Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003).

[21]  Ruey-Beei Wu,et al.  Reduction in reflections and ground bounce for signal line through a split power plane by using differential coupled microstrip lines , 2003, Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710).

[22]  Er-Ping Li,et al.  Parallelized computational technique for signal propagation analysis at very high speed differential transmission lines , 2003, 2003 IEEE Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.03CH37446).