A Study on the Optimization of Anisotropic Conductive Films for Sn-3Ag-0.5Cu-Based Flex-on-Board Application at a 250 °C Bonding Temperature
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Ming Yang | K. Paik | P. He | Mingliang L. Huang | Tiesong Lin | Shuye Zhang | Yang Wu | Jikun Du | Shu-ye Zhang