RF/microwave characterization of multilayer ceramic-based MCM technology

We present RF/microwave characterization of a 20-layer ceramic-based multichip module (MCM-C) on low temperature co-fired ceramic (LTCC). We investigated material properties and performance of embedded passives by design, fabrication and characterization of planar and multilayer integral inductors. Uniform dielectric constant, low loss property and high Q passives fabricated using this technology demonstrate the feasibility for implementing hybrid RF/microwave systems.

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