Towards the world smallest wireless sensor nodes with low power consumption for ‘Green’ sensor networks

Pursuit of the lowest size-limit of wireless sensor node may not only reduce production cost and power consumption, but also enable its layout-free ubiquitous applications, especially in `green' sensor network to compress energy consumption through visibility and optimization. In this work, we engage in developing the world smallest wireless sensor node form both system block integration and physical interconnection points-of-view. A customized RF-transmitter IC with low power consumption, universal interface to analog and digital sensors, and power management function was developed by using 0.18um 1.8V/3.3V 1P6M logic process. By introducing buried bump interconnection technology (B2it™), one of the world smallest wireless sensor nodes for humidity and temperature monitoring was successfully achieved with the size of 3.9×3.9×3.5mm. Configuration of above sensor node also enables its easy assembly with stand-alone power source and flexible antenna for wide variety of applications.

[1]  Cem Ersoy,et al.  Wireless sensor networks for healthcare: A survey , 2010, Comput. Networks.

[2]  Kirk Martinez,et al.  Environmental sensor networks , 2004, Computer.

[3]  H. Saito,et al.  Volume production technologies for passive and active components embedded PWB , 2012, 2012 2nd IEEE CPMT Symposium Japan.

[4]  J. Lu,et al.  Assembly of super compact wireless sensor nodes for environmental monitoring applications , 2013, 2013 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP).

[5]  Yung-Chih Liu,et al.  Wireless Sensor Network and Sensor Fusion Technology for Ubiquitous Smart living Space Applications , 2008 .

[6]  Santoshkumar,et al.  Development of Wireless Sensor Node to Monitor Poultry Farm , 2012, IAIT 2012.

[7]  Yung-Chih Liu,et al.  Wireless Sensor Network and Sensor Fusion Technology for Ubiquitous Smart Living Space Applications (Invited Paper) , 2008, 2008 Second International Symposium on Universal Communication.

[8]  Frank Niklaus,et al.  Wafer-Level Heterogeneous Integration for MOEMS, MEMS, and NEMS , 2011, IEEE Journal of Selected Topics in Quantum Electronics.

[9]  Jian Lu,et al.  Size-free MEMS-IC high-efficient integration by using carrier wafer with self-assembled monolayer (SAM) fine pattern , 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.

[10]  Fan Zhang,et al.  Power Consumption Monitor for Wireless Sensor Nodes , 2010, 2010 International Conference on Internet Technology and Applications.

[11]  Kenji Tsukamoto,et al.  Development of a sensor system for animal watching to keep human health and food safety , 2010 .