Chemical analysis of HfO2∕Si (100) film systems exposed to NH3 thermal processing

Nitrogen incorporation in HfO2∕SiO2 films utilized as high-k gate dielectric layers in advanced metal-oxide-semiconductor field effect transistors has been investigated. Thin HfO2 blanket films deposited by atomic layer deposition on either SiO2 or NH3 treated Si (100) substrates have been subjected to NH3 and N2 anneal processing. Several high resolution techniques including electron microscopy with electron energy loss spectra, grazing incidence x-ray diffraction, and synchrotron x-ray photoelectron spectroscopy have been utilized to elucidate chemical composition and crystalline structure differences between samples annealed in NH3 and N2 ambients as a function of temperature. Depth profiling of core level binding energy spectra has been obtained by using variable kinetic energy x-ray photoelectron spectroscopy with tunable photon energy. An “interface effect” characterized by a shift of the Si4+ feature to lower binding energy at the HfO2∕SiO2 interface has been detected in the Si 1s spectra; however,...

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