Improving the reliability of ball grid arrays under random vibration by optimization of module design

Abstract In this work, three different arrangements of circuit board in an electronic device were designed and the effects of random vibration frequencies on the reliability of ball grid arrays (BGA) in these arrangements were evaluated. The failure criterion in solder balls was the root mean square of peeling stress exerted during the dynamical loadings. According to the finite element method (FEM) results, the uttermost stress concentration was generated at the interface of printed circuit board (PCB) and the solder balls. It was also revealed that the increase of input power spectral density (PSD) decreased the fatigue life of solder joint in all the arrangements. Considering the arrangements of circuit boards, it was found that the maximum domain of peeling stress had a minimum effect on the solder balls when the heat sinks were away from the packages. The microstructural characterization of critical zone in solder balls indicated that with the increase of maximum peeling stress, the crack initiated and propagated along the interface.

[1]  Andino Maseleno,et al.  Effect of solder layer thickness on thermo-mechanical reliability of a power electronic system , 2018, Journal of Materials Science: Materials in Electronics.

[2]  Fang Lu,et al.  GARCH based degradation modeling of solder joint under vibration loading , 2017, 2017 Prognostics and System Health Management Conference (PHM-Harbin).

[3]  J. Wang,et al.  Effect of elevated temperature on PCB responses and solder interconnect reliability under vibration loading , 2015, Microelectron. Reliab..

[4]  Yusuf Cinar,et al.  Fatigue life estimations of solid-state drives with dummy solder balls under vibration , 2016 .

[5]  Zhaowei Zhong,et al.  Design for enhanced solder joint reliability of integrated passives device under board level drop test and thermal cycling test , 2003, Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003).

[6]  P. Lall,et al.  Model for BGA and CSP reliability in automotive underhood applications , 2004, IEEE Transactions on Components and Packaging Technologies.

[7]  Mei-Ling Wu,et al.  Rapid Assessment of BGA Fatigue Life Under Vibration Loading , 2010, IEEE Transactions on Advanced Packaging.

[8]  Min-Soo Kang,et al.  Evaluation of the characteristics of 305SAC lead-free solder joints between a chip electrode and a Cu-pad in automotive electronics , 2015 .

[9]  Fang Liu,et al.  Board Level Drop Test Analysis Based on Modal Test and Simulation , 2008 .

[10]  Suresh K. Sitaraman,et al.  Random vibration analysis of 3-Arc-Fan compliant interconnects , 2018, Microelectron. Reliab..

[11]  Qin Sun,et al.  A statistically consistent fatigue damage model based on Miner's rule , 2014 .

[12]  V. Samavatian,et al.  Combination of thermal cycling and vibration loading effects on the fatigue life of solder joints in a power module , 2018, Proceedings of the Institution of Mechanical Engineers, Part L: Journal of Materials: Design and Applications.

[13]  Abdelkhalak El Hami,et al.  Probabilistic fatigue damage estimation of embedded electronic solder joints under random vibration , 2017, Microelectron. Reliab..

[14]  J. K. Spelt,et al.  Load Sharing Between Discrete Solder Joints in Bending: Effect of Spacing and Joint Properties , 2016, IEEE Transactions on Device and Materials Reliability.

[15]  S. Saravanan,et al.  Fatigue failure of pb-free electronic packages under random vibration loads , 2018 .

[16]  Zhuang Fengqing,et al.  Patients’ Responsibilities in Medical Ethics , 2016 .

[17]  John H. L. Pang,et al.  Vibration reliability test and finite element analysis for flip chip solder joints , 2009, Microelectron. Reliab..

[18]  Bin Li,et al.  Reliability study of package-on-package stacking assembly under vibration loading , 2017, Microelectron. Reliab..