Flexible and stretchable electronics for wearable health devices

Measuring the quality of human health and well-being is one of the key growth areas in our society. Preferably, these measurements are done as unobtrusive as possible. These sensoric devices are then to be integrated directly on the human body as a patch or integrated into garments. This requires the devices to be very thin, flexible and sometimes even stretchable. An overview of recent technology developments in this domain and concrete application examples will be discussed.

[1]  Maarten Cauwe,et al.  High curvature bending characterization of ultra-thin chips and chip-on-foil assemblies , 2013, 2013 Eurpoean Microelectronics Packaging Conference (EMPC).

[2]  Yonggang Huang,et al.  Materials and Mechanics for Stretchable Electronics , 2010, Science.

[3]  J. Vanfleteren,et al.  Stretchable Electronics Technology for Large Area Applications: Fabrication and Mechanical Characterization , 2013, IEEE Transactions on Components, Packaging and Manufacturing Technology.

[4]  U. Schubert,et al.  Inkjet Printing of Narrow Conductive Tracks on Untreated Polymeric Substrates , 2008 .

[5]  J. Vanfleteren,et al.  Polyimide-Enhanced Stretchable Interconnects: Design, Fabrication, and Characterization , 2011, IEEE Transactions on Electron Devices.

[6]  Roel Kusters,et al.  Flipchip bonding of ultrahin Si dies onto PEN/PET substrates with low cost circuitry , 2010, 3rd Electronics System Integration Technology Conference ESTC.

[7]  M. Cauwe,et al.  Novel interconnect methodologies for ultra-thin chips on foils , 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

[8]  Roel Kusters,et al.  Flipchip Bonding of Si Chip on Flexible PEN Foil using Novel Electronic 100 μm Pitch Fan-out Circuitry , 2007 .

[9]  Martin Zimmermann,et al.  Ultra-thin chip technology and applications, a new paradigm in silicon technology , 2010 .

[10]  Jan Vanfleteren,et al.  The effects of encapsulation on deformation behavior and failure mechanisms of stretchable interconnects , 2011 .

[11]  Bart Vandevelde,et al.  Design of Metal Interconnects for Stretchable Electronic Circuits using Finite Element Analysis , 2007, 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007.

[12]  M. Kakihana,et al.  Materials Research Society Symposium - Proceedings , 2000 .

[13]  Maarten Cauwe,et al.  A chip embedding solution based on low-cost plastic materials as enabling technology for smart labels , 2012, 2012 4th Electronic System-Integration Technology Conference.