论文信息 - Thermal Cycling Reliability and Delamination of Anisotropic Conductive Adhesives Flip Chip on Organic Substrates With Emphasis on the Thermal Deformation

Thermal Cycling Reliability and Delamination of Anisotropic Conductive Adhesives Flip Chip on Organic Substrates With Emphasis on the Thermal Deformation

a Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology, Daejon 305-701, South Korea b MEMS Lab., Samsung Advanced Institute of Technology, P.O. Box 111, Suwon 440-600, South Korea c CARE-Electronic Packaging Laboratory, Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, 305-701, South Korea

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