论文信息 - Application of the Hilbert-Huang signal processing to ultrasonic nondestructive testing of composite materials

Application of the Hilbert-Huang signal processing to ultrasonic nondestructive testing of composite materials

A ball grid array semiconductor packaging technology is provided, which is characterized in that openings of a solder mask are formed on a given edge of a die attachment area, and entire or partial width of each opening is disposed outside the die attachment area. Accordingly, air within the opening of the solder mask is sufficiently eliminated during die bonding process, so as to prevent void formation as adhesive is filled into the opening. Therefore, in the follow-up steps, high temperature in reflowing process will not cause popcorn as in the prior-art, so as to remain good quality of the semiconductor package.

[1] Drai Redouane,et al. Flaw Detection in Ultrasonics Using Wavelets Transform and Split Spectrum processing , 2000 .

[2] L. Cohen,et al. Time-frequency distributions-a review , 1989, Proc. IEEE.

[3] D. Pagodinas,et al. Ultrasonic signal processing methods for detection of defects in composite materials , 2002 .

[4] José L. Muñoz-Cobo,et al. Hilbert–Huang analysis of BWR neutron detector signals: application to DR calculation and to corrupted signal analysis , 2003 .

[5] K. Baršauskas,et al. Ultrasonic signal processing methods for detection of defects in composite materials , 2005 .

[6] J. Saniie,et al. Generalized time-frequency representation of ultrasonic signals , 1993 .

[7] N. Huang,et al. The empirical mode decomposition and the Hilbert spectrum for nonlinear and non-stationary time series analysis , 1998, Proceedings of the Royal Society of London. Series A: Mathematical, Physical and Engineering Sciences.

[8] A. Abbate,et al. Signal detection and noise suppression using a wavelet transform signal processor: application to ultrasonic flaw detection , 1997, IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control.