Film deposition with the Sputter Gun

Film deposition by conventional diode techniques subjects the substrate to vigorous bombardment. The Sputter Gun, a recently developed magnetron sputtering device, contains the anode and cathode for the discharge process in the device itself. Because of this electrode arrangement and the magnetic field in the Sputter Gun the substrate plays a much more passive role in the discharge process, resulting in a lower flux of charged particles to the substrate. The reduced flux at the substrate results in lower substrate temperatures and different film properties. An auxiliary magnet placed below the substrate has been found useful in further modifying the charged‐particle flux to the substrate. Deposition rates were found to be relatively unchanged for the different configurations of the auxiliary magnet. Metallic films such as Cu and Au have been deposited using a dc discharge. Transparent, conductive In2−xSnxO3−y (ITO) has been deposited on a variety of substrates by means of a dc, rf, or a combination of dc ...