Small target compatible dimensional and analytical metrology for semiconductor nanostructures using x-ray fluorescence techniques

X-ray fluorescence techniques in special operation modes can provide valuable quantitative insights for semiconductor related applications and can be made compatible to typical sizes of homogeneously structured metrology pads. As their dimensions are usually in the order of several 10 μm per direction, it must be ensured that no adjacent regions are irradiated or that no x-ray fluorescence radiation from adjacent areas reaches the detector. As this can be realized by using small excitation beams, a multitude of information can be retrieved from such XRF data. In addition to elemental composition, including sensitivity to sub-surface features, one can derive quantitative amounts of material and even dimensional properties of the nanostructures under study. Here, we show three different approaches for studies related to semiconductor applications that are capable to be performed on real world dies with commonly sized metrology pads.

[1]  S. Rehbein,et al.  Quantitative Element-Sensitive Analysis of Individual Nanoobjects. , 2022, Small.

[2]  B. Beckhoff Traceable Characterization of Nanomaterials by X-ray Spectrometry Using Calibrated Instrumentation , 2022, Nanomaterials.

[3]  N. Felix,et al.  Review of nanosheet metrology opportunities for technology readiness , 2022, Journal of Micro/Nanopatterning, Materials, and Metrology.

[4]  R. Loo,et al.  Simultaneous Dimensional and Analytical Characterization of Ordered Nanostructures. , 2021, Small.

[5]  T. Nuytten,et al.  Spectroscopy: a new route towards critical-dimension metrology of the cavity etch of nanosheet transistors , 2021, Advanced Lithography.

[6]  F. Scholze,et al.  Grazing incidence-x-ray fluorescence for a dimensional and compositional characterization of well-ordered 2D and 3D nanostructures , 2020, Nanotechnology.

[7]  F. Bijkerk,et al.  A semi-analytical approach for the characterization of ordered 3D nanostructures using grazing-incidence X-ray fluorescence , 2020, Journal of synchrotron radiation.

[8]  J. Ryckaert,et al.  Novel forksheet device architecture as ultimate logic scaling device towards 2nm , 2019, 2019 IEEE International Electron Devices Meeting (IEDM).

[9]  D. Mocuta,et al.  Nanowire & nanosheet FETs for ultra-scaled, high-density logic and memory applications , 2020, Solid-State Electronics.

[10]  B. Parvais,et al.  First Demonstration of 3D stacked Finfets at a 45nm fin pitch and 110nm gate pitch technology on 300mm wafers , 2018, 2018 IEEE International Electron Devices Meeting (IEDM).

[11]  B. Beckhoff,et al.  A Compact Vibration Reduced Set-up for Scanning nm-XRF and STXM. , 2018, Microscopy and Microanalysis.

[12]  G. Bouche,et al.  The Complementary FET (CFET) for CMOS scaling beyond N3 , 2018, 2018 IEEE Symposium on VLSI Technology.

[13]  Diederik Verkest,et al.  IMEC N7, N5 and beyond: DTCO, STCO and EUV insertion strategy to maintain affordable scaling trend , 2018, Advanced Lithography.

[14]  F. Scholze,et al.  Element sensitive reconstruction of nanostructured surfaces with finite elements and grazing incidence soft X-ray fluorescence. , 2018, Nanoscale.

[15]  Alok Vaid,et al.  Metrology capabilities and needs for 7nm and 5nm logic nodes , 2017, Advanced Lithography.

[16]  Benjamin Bunday,et al.  HVM metrology challenges towards the 5nm node , 2016, SPIE Advanced Lithography.

[17]  Mark Y. Liu,et al.  A 14nm logic technology featuring 2nd-generation FinFET, air-gapped interconnects, self-aligned double patterning and a 0.0588 µm2 SRAM cell size , 2014, 2014 IEEE International Electron Devices Meeting.

[18]  R. Clark Emerging Applications for High K Materials in VLSI Technology , 2014, Materials.

[19]  Sean W. King,et al.  Research Updates: The three M's (materials, metrology, and modeling) together pave the path to future nanoelectronic technologies , 2013 .

[20]  B. Beckhoff,et al.  A novel instrument for quantitative nanoanalytics involving complementary X-ray methodologies. , 2013, The Review of scientific instruments.

[21]  B. Kanngießer,et al.  Quantification for 3D micro X-ray fluorescence , 2012 .

[22]  B. Kanngießer Quantification procedures in micro X-ray fluorescence analysis☆ , 2003 .

[23]  U. Flechsig,et al.  A plane-grating monochromator beamline for the PTB undulators at BESSY II. , 1998, Journal of synchrotron radiation.

[24]  M. Shur,et al.  Properties of advanced semiconductor materials : GaN, AlN, InN, BN, SiC, SiGe , 2001 .

[25]  G.E. Moore,et al.  Cramming More Components Onto Integrated Circuits , 1998, Proceedings of the IEEE.