A Prototype PZT Matrix Transducer With Low-Power Integrated Receive ASIC for 3-D Transesophageal Echocardiography

This paper presents the design, fabrication, and experimental evaluation of a prototype lead zirconium titanate (PZT) matrix transducer with an integrated receive ASIC, as a proof of concept for a miniature three-dimensional (3-D) transesophageal echocardiography (TEE) probe. It consists of an array of 9 × 12 piezoelectric elements mounted on the ASIC via an integration scheme that involves direct electrical connections between a bond-pad array on the ASIC and the transducer elements. The ASIC addresses the critical challenge of reducing cable count, and includes front-end amplifiers with adjustable gains and microbeamformer circuits that locally process and combine echo signals received by the elements of each 3 × 3 subarray. Thus, an order-of-magnitude reduction in the number of receive channels is achieved. Dedicated circuit techniques are employed to meet the strict space and power constraints of TEE probes. The ASIC has been fabricated in a standard 0.18-μm CMOS process and consumes only 0.44 mW/channel. The prototype has been acoustically characterized in a water tank. The ASIC allows the array to be presteered across ±37° while achieving an overall dynamic range of 77 dB. Both the measured characteristics of the individual transducer elements and the performance of the ASIC are in good agreement with expectations, demonstrating the effectiveness of the proposed techniques.

[1]  J. Arendt Paper presented at the 10th Nordic-Baltic Conference on Biomedical Imaging: Field: A Program for Simulating Ultrasound Systems , 1996 .

[2]  E A Fisher,et al.  Transesophageal echocardiography: procedures and clinical application. , 1991, Journal of the American College of Cardiology.

[3]  Andrea Mazzanti,et al.  A CMUT transceiver front-end with 100-V TX driver and 1-mW low-noise capacitive feedback RX amplifier in BCD-SOI technology , 2014, ESSCIRC 2014 - 40th European Solid State Circuits Conference (ESSCIRC).

[4]  J. Jensen,et al.  Calculation of pressure fields from arbitrarily shaped, apodized, and excited ultrasound transducers , 1992, IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control.

[5]  A. Nikoozadeh,et al.  An integrated circuit with transmit beamforming flip-chip bonded to a 2-D CMUT array for 3-D ultrasound imaging , 2009, IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control.

[6]  Travis N. Blalock,et al.  Experimental System Prototype of a Portable, Low-Cost, C-Scan Ultrasound Imaging Device , 2008, IEEE Transactions on Biomedical Engineering.

[7]  Geneviève Côté msc frcpc,et al.  Transesophageal echocardiography-related complications , 2008 .

[8]  Nico de Jong,et al.  Front-end receiver electronics for a matrix transducer for 3-D transesophageal echocardiography , 2012, IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control.

[9]  Hae-Seung Lee,et al.  Ultrasonic Imaging Transceiver Design for CMUT: A Three-Level 30-Vpp Pulse-Shaping Pulser With Improved Efficiency and a Noise-Optimized Receiver , 2013, IEEE Journal of Solid-State Circuits.

[10]  Y. C. Chan,et al.  Adhesion strength and contact resistance of flip chip on flex packages--effect of curing degree of anisotropic conductive film , 2004, Microelectron. Reliab..

[11]  Amin Nikoozadeh,et al.  3D volumetric ultrasound imaging with a 32×32 CMUT array integrated with front-end ICs using flip-chip bonding technology , 2013, 2013 IEEE International Solid-State Circuits Conference Digest of Technical Papers.

[12]  K. Boone,et al.  Effect of skin impedance on image quality and variability in electrical impedance tomography: a model study , 1996, Medical and Biological Engineering and Computing.

[13]  N de Jong,et al.  Design of a micro-beamformer for a 2D piezoelectric ultrasound transducer , 2009, 2009 IEEE International Ultrasonics Symposium.

[14]  Jaime Ramirez-Angulo,et al.  Power-efficient class AB CMOS buffer , 2009 .

[15]  Thomas A. Cook,et al.  Food and Drug Administration (FDA): Record Keeping for , 2015 .

[16]  O. Oralkan,et al.  Integration of 2D CMUT arrays with front-end electronics for volumetric ultrasound imaging , 2008, IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control.

[17]  André Denault,et al.  Transesophageal echocardiography-related complications , 2008, Canadian journal of anaesthesia = Journal canadien d'anesthesie.

[18]  Gerard C. M. Meijer,et al.  Ultrasound beamformer using pipeline-operated S/H delay stages and charge-mode summation , 2011 .

[19]  N. de Jong,et al.  Design of a miniature ultrasound probe for 3D transesophageal echocardiography , 2014, 2014 IEEE International Ultrasonics Symposium.

[20]  N. de Jong,et al.  Design of a low power time-gain-compensation amplifier for a 2D piezoelectric ultrasound transducer , 2010, 2010 IEEE International Ultrasonics Symposium.

[21]  N de Jong,et al.  A KLM-circuit model of a multi-layer transducer for acoustic bladder volume measurements. , 2006, Ultrasonics.

[22]  Omer Oralkan,et al.  A multichannel pipeline analog-to-digital converter for an integrated 3-D ultrasound imaging system , 2003, IEEE J. Solid State Circuits.

[23]  B. Savord,et al.  Fully sampled matrix transducer for real time 3D ultrasonic imaging , 2003, IEEE Symposium on Ultrasonics, 2003.

[24]  Phillip E Allen,et al.  CMOS Analog Circuit Design , 1987 .

[25]  Raimund Erbel,et al.  Safety of Transesophageal Echocardiography: A Multicenter Survey of 10,419 Examinations , 1991, Circulation.

[26]  Z. Yu,et al.  Low-Power Receive-Electronics for a Miniature 3D Ultrasound Probe , 2012 .

[27]  Ivan S Salgo,et al.  Three-dimensional echocardiographic technology. , 2007, Cardiology clinics.