Design for manufacturability in submicron domain

Key characteristics of newly emerging IC technologies render the traditional concept of die size minimization and traditional "design rules" insufficient to handle the design-manufacturing interface. This tutorial surveys the design and process characteristics relevant to the manufacturability of submicron ICs. The discussion also covers analysis of design for manufacturability (DFM) trade-offs. Yield and cost models needed to analyze these trade-offs are explained as well.

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