Flip-Chip and Backside Techniques
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Edward I. Cole | Daniel L. Barton | Karoline Bernhard-Hofer | D. Barton | E. I. Cole | Karoline Bernhard-Hofer
[1] Richard M. Osgood,et al. Rapid direct writing of high‐aspect ratio trenches in silicon: Process physics , 1988 .
[2] D. T. Hurley,et al. Dynamics of backside wafer level microprobing , 1998, 1998 IEEE International Reliability Physics Symposium Proceedings. 36th Annual (Cat. No.98CH36173).
[3] H. Koyama,et al. New non-bias optical beam induced current (NB-OBIC) technique for evaluation of Al interconnects , 1995, Proceedings of 1995 IEEE International Reliability Physics Symposium.
[4] D. Benson,et al. TIVA and SEI Developments for Enhanced Front and Backside Interconnection Failure Analysis , 1999 .
[5] J. Kash,et al. Picosecond hot electron light emission from submicron complementary metal–oxide–semiconductor circuits , 1997 .
[6] R. Evershed,et al. Mat Res Soc Symp Proc , 1995 .
[7] Richard H. Livengood,et al. Application of advanced micromachining techniques for the characterization and debug of high performance microprocessors , 1999 .
[8] Jacques I. Pankove,et al. Optical Processes in Semiconductors , 1971 .
[9] E. J. Rymaszewski,et al. Microelectronics Packaging Handbook , 1988 .
[10] K. DeHaven,et al. Controlled collapse chip connection (C4)-an enabling technology , 1994, 1994 Proceedings. 44th Electronic Components and Technology Conference.
[11] Hermann Mader,et al. Technologie hochintegrierter Schaltungen , 1988 .
[12] Daniel J. Ehrlich,et al. Laser microfabrication : thin film processes and lithography , 1989 .
[13] Th. Förster,et al. Landolt-Börnstein, Zahlenwerte und Funktionen aus Naturwissenschaften und Technik , 1969 .
[14] Mario Paniccia,et al. Novel optical probing technique for flip chip packaged microprocessors , 1998, Proceedings International Test Conference 1998 (IEEE Cat. No.98CH36270).
[15] P. Tangyunyong,et al. Backside localization of open and shorted IC interconnections , 1998, 1998 IEEE International Reliability Physics Symposium Proceedings. 36th Annual (Cat. No.98CH36173).
[16] Diane K. Stewart,et al. Gas-assisted etching with focused ion beam technology , 1993 .
[17] Daniel J. Ehrlich,et al. A review of laser–microchemical processing , 1983 .
[18] D. Gerke,et al. A hi-density C4/CBGA interconnect technology for a CMOS microprocessor , 1994 .
[19] Kiyoshi Nikawa,et al. New capabilities of OBIRCH method for fault localization and defect detection , 1997, Proceedings Sixth Asian Test Symposium (ATS'97).
[20] R. H. Livengood,et al. FIB techniques to debug flip-chip integrated circuits , 1998 .
[21] J. E. Semmens,et al. Flip chip package failure mechanisms , 1998 .
[22] Edward I. Cole,et al. Novel failure analysis techniques using photon probing with a scanning optical microscope , 1994, Proceedings of 1994 IEEE International Reliability Physics Symposium.
[23] R. Soref,et al. Electrooptical effects in silicon , 1987 .
[24] Daniel J. Ehrlich,et al. Laser‐chemical three‐dimensional writing for microelectromechanics and application to standard‐cell microfluidics , 1992 .
[25] Daniel J. Ehrlich,et al. Stereo laser micromachining of silicon , 1992 .
[26] E.I. Cole,et al. Rapid localization of IC open conductors using charge-induced voltage alteration (CIVA) , 1992, 30th Annual Proceedings Reliability Physics 1992.