Thermal Flow-Sensor Drift Reduction by Thermopile Voltage Cancellation via Power Feedback Control

The research question that is addressed in this paper relates to the performance limitations of thermal flow sensors due to miniaturization. Sensor elements in current microflow sensors are mostly made by metal thin films. The problem is that thin-films reproduce poorly and that practically all material properties are subject to drift. This drift and poor reproducibility translates directly into the accuracy of thermal microflow sensors. This paper presents a thermal flow sensor consisting of freely suspended silicon-rich silicon-nitride microchannels with an integrated thermopile in combination with up and downstream Al heater resistors. The drift-free zero offset of a thermopile at uniform temperature is exploited in a feedback loop controlling the dissipated powers in Al heater resistors, reducing inevitable influences of resistance drift, and mismatch of thin-film metal resistors. The control system attempts to cancel the flow-induced temperature imbalance across the thermopile by controlling a power difference between both heater resistors, thereby giving a measure of the flow rate nearly independent of material drift.

[1]  Rong Zhu,et al.  Temperature compensation for thermal anemometers using temperature sensors independent of flow sensors , 2011 .

[2]  Gerald Urban,et al.  Wide range semiconductor flow sensors , 2000 .

[3]  P Bruschi,et al.  An Offset Compensation Method With Low Residual Drift for Integrated Thermal Flow Sensors , 2011, IEEE Sensors Journal.

[4]  Remco J. Wiegerink,et al.  Miniaturized thermal flow sensor with planar-integrated sensor structures on semicircular surface channels , 2008 .

[5]  A. Petropoulos,et al.  Study of an integrated thermal sensor in different operational modes, under laminar, transitional and turbulent flow regimes , 2008 .

[6]  Z. Moktadir,et al.  Long range diffusion noise in platinum microwires with metallic adhesion layers , 2007, cond-mat/0703581.

[7]  Lars-Erik Josefson,et al.  Inhomogeneity Measurements of Long Thermocouples using a Short Movable Heating Zone , 2008 .

[8]  Sung Jin Kim,et al.  Development of a micro-thermal flow sensor with thin-film thermocouples , 2006 .

[9]  P. Bruschi,et al.  Smart Flow Sensor With On-Chip CMOS Interface Performing Offset and Pressure Effect Compensation , 2012, IEEE Sensors Journal.

[10]  Massimo Piotto,et al.  A flow sensor for liquids based on a single temperature sensor operated in pulsed mode , 2004 .

[11]  David P. Field,et al.  Investigating the microstructure-reliability relationship in Cu damascene lines , 2001 .

[12]  A. Uedono,et al.  Impact of Al in Cu alloy interconnects on electro and stress migration reliabilities , 2008 .

[13]  Dileep Mampallil,et al.  Electrical cross-correlation spectroscopy: measuring picoliter-per-minute flows in nanochannels. , 2012, Physical review letters.

[14]  M. Elwenspoek,et al.  A new class of thermal flow sensors using /spl Delta/T=0 as a control signal , 2000, Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308).

[15]  M. Dijkstra,et al.  Ambient Temperature-Gradient Compensated Low-Drift Thermopile Flow Sensor , 2009, 2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems.

[16]  Weeratunge Malalasekera,et al.  An introduction to computational fluid dynamics - the finite volume method , 2007 .

[17]  W. R. Hunter,et al.  Characterization of electromigration parameters in VLSI metallizations by noise measurements , 1991 .

[18]  D. Rowe CRC Handbook of Thermoelectrics , 1995 .

[19]  Z. Djuric,et al.  Multipurpose MEMS thermal sensor based on thermopiles , 2008 .

[20]  A. W. van Herwaarden,et al.  The seebeck effect in silicon ICs , 1984 .

[21]  Massimo Piotto,et al.  A double heater integrated gas flow sensor with thermal feedback , 2005 .

[22]  Miko Elwenspoek,et al.  Low-drift flow sensor with zero-offset thermopile-based power feedback , 2008, 2008 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS.

[23]  A. Herwaarden Thermal vacuum sensors based on integrated silicon thermopiles , 1987 .

[24]  B K Jones,et al.  The excess noise in integrated circuit interconnects before and after electromigration damage , 1999 .

[25]  S. Roh,et al.  Sensitivity enhancement of a silicon micro-machined thermal flow sensor , 2006 .

[26]  Yu-Chong Tai,et al.  MEMS flow sensors for nano-fluidic applications , 2000, Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308).

[27]  Bruno Neri,et al.  Low-frequency noise measurements as a characterization tool for degradation phenomena in solid-state devices , 2000 .

[28]  Giuseppe Iannaccone,et al.  Noise and reliability in simulated thin metal films , 2008, Microelectron. Reliab..

[29]  Fausto Fantini,et al.  Electromigration in thin-films for microelectronics , 1993 .

[30]  Remco J. Wiegerink,et al.  A versatile surface channel concept for microfluidic applications , 2007 .

[31]  F. Giacomozzi,et al.  Low frequency electromigration noise and film microstructure in Al/Si stripes: Electrical measurements and TEM analysis , 1993 .

[32]  A. K. Raychaudhuri,et al.  Evolution of 1/f α noise during electromigration stressing of metal film: Spectral signature of electromigration process , 2006 .

[33]  H. Droogendijk,et al.  Highly sensitive micro coriolis mass flow sensor , 2008, 2008 IEEE 21st International Conference on Micro Electro Mechanical Systems.