Deposition of thin organosilicon polymer films in atmospheric pressure glow discharge

The atmospheric pressure glow discharge burning in nitrogen with small admixture of organosilicon compounds such as hexamethyldisilazane or hexamethyldisiloxane was used for the deposition of thin organosilicon polymer films. The properties of the discharge were studied by means of optical emission spectroscopy and electrical measurements. The deposited films were characterized by atomic force microscopy, x-ray photoelectron spectroscopy, infrared transmission measurements, ellipsometry, depth sensing indentation technique and contact angle measurements. The films were polymer-like, transparent in the visible range, with uniform thickness and without pinholes. The film hardness varied from 0.3 to 0.6 GPa depending on deposition conditions, the elastic modulus was in the range 15-28 GPa and the surface free energy was in the range 26-45 mJ m-2. The studied films exhibited good adhesion to the substrate.

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