Picosecond Laser Micro-welded Similar and Dissimilar Material

We report the successful picoseconds laser welding of a range of similar and dissimilar materials. The welds are formed by a tightly focused 1030 nm, 5.9 ps, 400 kHz laser system which induces microplasma formation. With suitably well prepared samples the plasma is confined and resolidifies into a weld. Due to the speed of the int eraction time between laser and material the heat affected zone is restricted to a few 100 μm around the weld making it an essentially cold process. We specifically report the capability to weld fused silica, borosilicate and sapphire to aluminium, copper, stainless steel, silicon and silicon carbid e. Analysis of material mobility in fused silica we lds has been investigated through confocal fluorescent microscopy of an Nd doped sample welded to an undoped sample. The results indicate limited mobili ty in the head affected zone but high mobility in the microplasma region. While the process requires significant surface preparation (Ra < 60nm) the versatility of the process allows a wide range of m aterials to be welded with essentially the same laser system.

[1]  J. Shephard,et al.  Picosecond laser welding of similar and dissimilar materials. , 2014, Applied optics.

[2]  Ilya Alexeev,et al.  Characterization of Shear Strength and Bonding Energy of Laser Pro- duced Welding Seams in Glass , 2012 .

[3]  Huan Huang,et al.  Ultrashort pulsed fiber laser welding and sealing of transparent materials. , 2012, Applied optics.

[4]  Réal Vallée,et al.  Reinforced direct bonding of optical materials by femtosecond laser welding. , 2012, Applied optics.

[5]  Andreas Tünnermann,et al.  Welding of transparent materials with ultrashort laser pulses , 2012, Other Conferences.

[6]  Panjawat Kongsuwan,et al.  Transmission Welding of Glass by Femtosecond Laser: Mechanism and Fracture Strength , 2012 .

[7]  Koji Sugioka,et al.  Efficient microwelding of glass substrates by ultrafast laser irradiation using a double-pulse train. , 2011, Optics letters.

[8]  Michael Schmidt,et al.  Evaluation of nonlinear absorptivity in internal modification of bulk glass by ultrashort laser pulses. , 2011, Optics express.

[9]  A. Tünnermann,et al.  Bonding of glass with femtosecond laser pulses at high repetition rates , 2011 .

[10]  K. Itoh,et al.  Direct Welding between Copper and Glass Substrates with Femtosecond Laser Pulses , 2008 .

[11]  A. Horn,et al.  Investigations on ultrafast welding of glass–glass and glass–silicon , 2008 .

[12]  J. Gottmann,et al.  Local Melting of Glass Material and Its Application to Direct Fusion Welding by Ps-laser Pulses , 2007 .

[13]  K. Itoh,et al.  Laser micro-welding of transparent materials by a localized heat accumulation effect using a femtosecond fiber laser at 1558 nm. , 2006, Optics express.

[14]  J. Nishii,et al.  Space-selective laser joining of dissimilar transparent materials using femtosecond laser pulses , 2006 .

[15]  J. Nishii,et al.  Welding of Transparent Materials Using Femtosecond Laser Pulses , 2005 .

[16]  F. Tay,et al.  Localized laser assisted eutectic bonding of quartz and silicon by Nd:YAG pulsed-laser , 2005 .

[17]  J. Oberhammer,et al.  Sealing of adhesive bonded devices on wafer level , 2004 .

[18]  K. Itoh,et al.  Ultrashort Laser Welding and Joining , 2012 .

[19]  W. Marsden.  I and J , 2012 .

[20]  Michael Schmidt,et al.  Novel fusion welding technology of glass using ultrashort pulse lasers , 2008 .

[21]  Jian-Qiang Lu,et al.  Adhesive wafer bonding , 2006 .