Smart cards and Method of manufacturing the smart card

This disclosure includes a digital block comprising having a front and back, being disposed on the front surface and the substrate, the substrate having a first height between the back front, the analog block, and a plurality of digital circuit comprising a plurality of analog circuit a circuit layer, and is disposed in the substrate, has a first small second higher than the first height from the front surface of the substrate, and starting the second smart card to the height including at least one trench capacitor can change by the back attack on the substrate do.