Electromigration: A review

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[36]  M. Dion EXTRA-EM: extraction of temperature and resistance for acceleration of electromigration at wafer-level , 1991, 29th Annual Proceedings Reliability Physics 1991.

[37]  Y. Higuchi,et al.  Wafer-level Jramp and J-constant electromigration testing of conventional and SWEAT patterns assisted by a thermal and electrical simulator , 1991, 29th Annual Proceedings Reliability Physics 1991.

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[41]  C. R. Crowell,et al.  Simulation and testing of temperature distribution and resistance versus power for SWEAT and related Joule-heated metal-on-insulator structures , 1990, 28th Annual Proceedings on Reliability Physics Symposium.

[42]  Chenming Hu,et al.  Effects of self-heating on integrated circuit metallization lifetimes , 1989, International Technical Digest on Electron Devices Meeting.

[43]  R. Landauer Comment on Lodder's “exact” electromigration theory , 1989 .

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[68]  M. J. McNutt,et al.  Effects of Substrate Thermal Characteristics on the Electromigration Behavior of Al Thin Film Conductors , 1983, 21st International Reliability Physics Symposium.

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[75]  M. H. Woods,et al.  Elimination of Silicon Electromigration in Contacts by the use of an Interposed Barrier Metal , 1982, 20th International Reliability Physics Symposium.

[76]  S. Vaidya,et al.  Electromigration Induced Leakage at Shallow Junction Contacts Metallized with Aluminum/Poly-Silicon , 1982, 20th International Reliability Physics Symposium.

[77]  Kiyoshi Nikawa,et al.  Monte Carlo Calculations Based on the Generalized Electromigration Failure Model , 1981, 19th International Reliability Physics Symposium.

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[79]  D. B. Fraser,et al.  Electromigration Resistance of Fine-Line Al for VLSI Applications , 1980, 18th International Reliability Physics Symposium.

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