A study of Sn-Bi-Ag-(In) lead-free solders
暂无分享,去创建一个
L. Tsay | R. Shiue | J. Ou | Chun-Lun Lin
[1] R. Shiue,et al. The microstructural observation and wettability study of brazing Ti-6Al-4V and 304 stainless steel using three braze alloys , 2002 .
[2] R. K. Shiue,et al. Effect of solder creep on the reliability of large area die attachment , 2001, Microelectron. Reliab..
[3] C. Handwerker,et al. The effect of Pb contamination on the solidification behavior of Sn-Bi solders , 2001 .
[4] C. Kao,et al. Long-term aging study on the solid-state reaction between 58Bi42Sn solder and Ni substrate , 2000 .
[5] C. Kao,et al. Formation and resettlement of (AuxNi1−x)Sn4 in solder joints of ball-grid-array packages with the Au/Ni surface finish , 2000 .
[6] Matt A. Korhonen,et al. Reactions of lead-free solders with CuNi metallizations , 2000 .
[7] Andrew M. Minor,et al. Inhibiting growth of the Au0.5Ni0.5Sn4 intermetallic layer in Pb-Sn solder joints reflowed on Au/Ni metallization , 2000 .
[8] Y. Chan,et al. Microstructural evolution of a lead-free solder alloy Sn-Bi-Ag-Cu prepared by mechanical alloying during thermal shock and aging , 2000 .
[9] Y. Chan,et al. Developing a lead-free solder alloy Sn-Bi-Ag-Cu by mechanical alloying , 2000 .
[10] Wolfgang H. Müller,et al. A study of the coarsening in tin/lead solders , 2000 .
[11] Robert Darveaux,et al. Solder joint fatigue life of fine pitch BGAs – impact of design and material choices , 2000 .
[12] D. J. Xie,et al. A new experimental method to evaluate creep fatigue life of flip-chip solder joints with underfill , 2000 .
[13] M. Abtew,et al. Lead-free Solders in Microelectronics , 2000 .
[14] S. Corbin,et al. Development of transient liquid phase sintered (TLPS) Sn-Bi solider pastes , 2000 .
[15] Guna S Selvaduray,et al. Solder joint fatigue models: review and applicability to chip scale packages , 2000 .
[16] J. Lai,et al. Lead free solder alloys Sn-Zn and Sn-Sb prepared by mechanical alloying , 2000 .
[17] Leon M Keer,et al. Damage evolution governed by microcrack nucleation with application to the fatigue of 63Sn–37Pb solder , 1999 .
[18] Semyon Vaynman,et al. Development of fluxes for lead-free solders containing zinc , 1999 .
[19] D. Stone,et al. Viscoelastic behavior of superplastic 37 wt% Pb 63 wt% Sn over a wide range of frequency and time , 1999 .
[20] Hyuck-Mo Lee,et al. Interfacial reaction between Sn-1Bi-5In-9Zn solder and Cu substrate , 1999 .
[21] D. Shangguan,et al. Microstructure changes in Sn-3.5Ag solder alloy during creep , 1998 .
[22] Taekoo Lee,et al. Finite element analysis for solder ball failures in chip scale package , 1997, Proceedings of the 1997 6th International Symposium on the Physical and Failure Analysis of Integrated Circuits.
[23] H. Steen,et al. Development and validation of a lead-free alloy for solder paste applications , 1997 .
[24] Seung Wook Yoon,et al. Thermodynamics-aided alloy design and evaluation of Pb-free solder, Sn-Bi-In-Zn system , 1997 .
[25] Dong Nyung Lee,et al. A thermodynamic study on the AgSbSn system , 1996 .
[26] J. Glazer. Metallurgy of low temperature Pb-free solders for electronic assembly , 1995 .
[27] M. Schwartz,et al. Brazing: For the engineering technologist , 1994 .
[28] R. E. Lee. Scanning Electron Microscopy and X-Ray Microanalysis , 1992 .
[29] David M. Jacobson,et al. Principles of Soldering and Brazing , 1992 .
[30] D. Coleman,et al. Materials characterization and chemical analysis : by J.P. Sibilia, VCH Publishers Inc., 1988, DM 75.00, £ 25.95, (v + 318 pages) ISBN 0-89573-269-6 , 1989 .
[31] Lawrence H. Bennett,et al. Binary alloy phase diagrams , 1986 .