A comparison of heat sink geometries for laminar forced convection: Numerical simulation of periodically developed flow

In this study, we have attempted to compare the heat transfer performance of various commonly used fin geometries. Realistic, manufacturable geometries are optimized for minimization of thermal resistance at moderate laminar air velocities. The basis of comparison was chosen to be a circular array of 1 mm diameter pin fins with a 2 mm pitch. The pitch-to-width ratio of the other geometries were chosen to provide equal ratios of fin area to base area. CFD simulations were carried out in a two-dimensional computational domain bounded by planes of symmetry parallel to the flow. The air velocity was in the range of 0.5 to 5 m/s. A comparison of heat transfer coefficients and pressure drops is presented.

[1]  Masaru Ishizuka,et al.  Cooling performance of plate fins for multichip modules , 1994, Proceedings of 1994 4th Intersociety Conference on Thermal Phenomena in Electronic Systems (I-THERM).

[2]  Adrian Bejan,et al.  Optimal Arrays of Pin Fins and Plate Fins in Laminar Forced Convection , 1993 .

[3]  Ephraim M Sparrow,et al.  Performance comparisons among geometrically different pin-fin arrays situated in an oncoming longitudinal flow , 1982 .

[4]  J. R. Culham,et al.  Thermal modeling of isothermal cuboids and rectangular heat sinks cooled by natural convection , 1994 .

[5]  Richard A. Wirtz,et al.  Comparison of the Cooling Performance of Staggered and In-Line Arrays of Electronic Packages , 1996 .

[6]  S. Balachandar,et al.  Heat transfer enhancement mechanisms in inline and staggered parallel-plate fin heat exchangers , 1997 .

[7]  T. Nishimura,et al.  Experimental Validation of Numerical Analysis of Flow across Tube Banks for Laminar Flow , 1991 .

[8]  J. P. V. Doormaal,et al.  ENHANCEMENTS OF THE SIMPLE METHOD FOR PREDICTING INCOMPRESSIBLE FLUID FLOWS , 1984 .

[9]  A. V. Barrett,et al.  Characterization of longitudinal fin heat sink thermal performance and flow bypass effects through CFD methods , 1997, Thirteenth Annual IEEE. Semiconductor Thermal Measurement and Management Symposium.

[10]  C. L. Chapman,et al.  Thermal performance of an elliptical pin fin heat sink , 1994, Proceedings of 1994 IEEE/CHMT 10th Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM).

[11]  Richard A. Wirtz,et al.  Effect of Flow Bypass on the Performance of Longitudinal Fin Heat Sinks , 1994 .

[12]  Richard A. Wirtz,et al.  Thermal Performance of Pin-Fin Fan-Sink Assemblies , 1997 .

[13]  Ephraim M Sparrow,et al.  Heat transfer from pin-fins situated in an oncoming longitudinal flow which turns to crossflow , 1982 .

[14]  R. Keyes Heat transfer in forced convection through fins , 1984, IEEE Transactions on Electron Devices.

[15]  P. W. Runstadler,et al.  Numerical and experimental evaluation of planar and staggered heat sinks , 1996, InterSociety Conference on Thermal Phenomena in Electronic Systems, I-THERM V.