Effect of residual chips on the material removal process of the bulk metallic glass studied by in situ scratch testing inside the scanning electron microscope

Research on material removal mechanism is meaningful for precision and ultra-precision manufacturing. In this paper, a novel scratch device was proposed by integrating the parasitic motion principle linear actuator. The device has a compact structure and it can be installed on the stage of the scanning electron microscope (SEM) to carry out in situ scratch testing. Effect of residual chips on the material removal process of the bulk metallic glass (BMG) was studied by in situ scratch testing inside the SEM. The whole removal process of the BMG during the scratch was captured in real time. Formation and growth of lamellar chips on the rake face of the Cube-Corner indenter were observed dynamically. Experimental results indicate that when lots of chips are accumulated on the rake face of the indenter and obstruct forward flow of materials, materials will flow laterally and downward to find new location and direction for formation of new chips. Due to similar material removal processes, in situ scratch testi...

[1]  K. Sundaram,et al.  Polishing mechanism of tantalum films by SiO 2 particles , 2003 .

[2]  Zhaojun Yang,et al.  A novel driving principle by means of the parasitic motion of the microgripper and its preliminary application in the design of the linear actuator. , 2012, The Review of scientific instruments.

[3]  J. Michler,et al.  Investigation of wear mechanisms through in situ observation during microscratching inside the scanning electron microscope , 2005 .

[4]  Masahiko Yoshino,et al.  Some experiments on the scratching of silicon:: In situ scratching inside an SEM and scratching under high external hydrostatic pressures , 2001 .

[5]  Jianzhong Jiang,et al.  CuZrAlTi Bulk Metallic Glass with Enhanced Glass‐Forming Ability, Mechanical Properties, Corrosion Resistance and Biocompatibility , 2012 .

[6]  D. Guo,et al.  Material removal mechanism of precision grinding of soft-brittle CdZnTe wafers , 2010 .

[7]  S. Agarwal,et al.  Experimental investigation of surface/subsurface damage formation and material removal mechanisms in SiC grinding , 2008 .

[8]  Staffan Jacobson,et al.  Failure mode analysis of TiN-coated high speed steel: In situ scratch adhesion testing in the scanning electron microscope , 1990 .

[9]  Fritz Klocke,et al.  Material removal mechanisms in ultrasonic-assisted diamond turning of brittle materials , 2004 .

[10]  S. Graça,et al.  Micro-to-Nano Indentation and Scratch Hardness in the Ni–Co System: Depth Dependence and Implications for Tribological Behavior , 2008 .

[11]  Libo Zhou,et al.  Deformation and material removal in a nanoscale multi-layer thin film solar panel using nanoscratch , 2011 .

[12]  Y. Liu,et al.  Experimental investigations of machining characteristics and removal mechanisms of advanced ceramics in high speed deep grinding , 2003 .

[13]  S. Hogmark,et al.  Experiences from scratch testing of tribological PVD coatings , 1997 .

[14]  Liangchi Zhang,et al.  Polishing of polycrystalline diamond by the technique of dynamic friction. Part 2: Material removal mechanism , 2007 .

[15]  Hu Huang,et al.  Influences of Sample Preparation on Nanoindentation Behavior of a Zr-Based Bulk Metallic Glass , 2012, Materials.

[16]  Albert J. Shih,et al.  Chip formation, cutting forces, and tool wear in turning of Zr-based bulk metallic glass , 2004 .

[17]  S. V. Prasad,et al.  The design and some applications of anin situ SEM scratch tester , 1984 .

[18]  Jiwang Yan,et al.  Mechanism for material removal in diamond turning of reaction-bonded silicon carbide , 2009 .

[19]  Siyuan Yu,et al.  Investigation of material removal mechanism of silicon wafer in the chemical mechanical polishing process using molecular dynamics simulation method , 2009 .

[20]  S. Agarwal,et al.  Grinding characteristics, material removal and damage formation mechanisms in high removal rate grinding of silicon carbide , 2010 .

[21]  Bin Lin,et al.  An experimental study on molecular dynamics simulation in nanometer grinding , 2003 .

[22]  L. Dai,et al.  Formation Mechanism Of Lamellar Chips During Machining Of Bulk Metallic Glass , 2009 .

[23]  G. Pharr,et al.  An improved technique for determining hardness and elastic modulus using load and displacement sensing indentation experiments , 1992 .

[24]  Berend Denkena,et al.  Ductile and brittle material removal mechanisms in natural nacre—A model for novel implant materials , 2010 .

[25]  Xun Chen,et al.  Experimental investigation of material removal mechanism in single grit grinding , 2012 .

[26]  Zhenqiang Yao,et al.  Material removal of optical glass BK7 during single and double scratch tests , 2011 .

[27]  J. G. Wang,et al.  Nano-scratch behavior of a bulk Zr-10Al-5Ti-17.9Cu-14.6Ni amorphous alloy , 2000 .