Structural changes in silicon implanted by phosphorus

Research of structural changes in subsurface layers of Si single crystals during formatting amorphous layers hidden under the surface are carried out. It established, that phosphorus ion (with 180 keV energy and doze of the order 1015 ion/cm2) implantation and subsequent short-term temperature annealing at T equals 500 degree(s)C are caused great structural changes in subsurface areas. The great strains in direction perpendicular to interface are characteristic of structures formed in this way.