Monolithic fabrication of millimeter-scale machines

Silicon-based MEMS techniques dominate sub-millimeter scale manufacturing, while a myriad of conventional methods exist to produce larger machines measured in centimeters and beyond. So-called mesoscale devices, existing between these length scales, remain difficult to manufacture. We present a versatile fabrication process, loosely based on printed circuit board manufacturing techniques, for creating monolithic, topologically complex, three-dimensional machines in parallel at the millimeter to centimeter scales. The fabrication of a 90?mg flapping wing robotic insect demonstrates the sophistication attainable by these techniques, which are expected to support device manufacturing on an industrial scale.

[1]  K.E. Petersen,et al.  Silicon as a mechanical material , 1982, Proceedings of the IEEE.

[2]  R. Ramadoss,et al.  MEMS-Capacitive Pressure Sensor Fabricated Using Printed-Circuit-Processing Techniques , 2006, IEEE Sensors Journal.

[3]  Alper Bozkurt,et al.  Low-cost flexible printed circuit technology based microelectrode array for extracellular stimulation of the invertebrate locomotory system , 2011 .

[4]  Denis C. Daly,et al.  A Pulsed UWB Receiver SoC for Insect Motion Control , 2010, IEEE Journal of Solid-State Circuits.

[5]  Yan,et al.  Wing transmission for a micromechanical flying insect , 2001 .

[6]  F. Tseng,et al.  EFAB: rapid, low-cost desktop micromachining of high aspect ratio true 3-D MEMS , 1999, Technical Digest. IEEE International MEMS 99 Conference. Twelfth IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.99CH36291).

[7]  Victor M. Bright,et al.  Fabrication, assembly, and testing of RF MEMS capacitive switches using flexible printed circuit technology , 2003 .

[8]  J. P. Whitney,et al.  Pop-up book MEMS , 2011 .

[9]  R. Fearing,et al.  Optimal energy density piezoelectric bending actuators , 2005 .

[10]  George M. Whitesides,et al.  Surface tension-powered self-assembly of microstructures - the state-of-the-art , 2003 .

[11]  M. Bachman,et al.  MEMS in laminates , 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

[12]  Robert J. Wood,et al.  Microrobot Design Using Fiber Reinforced Composites , 2008 .

[13]  William C. Tang,et al.  Electrostatic-comb drive of lateral polysilicon resonators , 1990 .

[14]  J. Bustillo,et al.  Surface micromachining for microelectromechanical systems , 1998, Proc. IEEE.

[15]  Jack W. Judy,et al.  Microelectromechanical systems (MEMS): fabrication, design and applications , 2001 .

[16]  Robert J. Wood,et al.  The First Takeoff of a Biologically Inspired At-Scale Robotic Insect , 2008, IEEE Transactions on Robotics.

[17]  R. Ghodssi,et al.  High-speed microfabricated silicon turbomachinery and fluid film bearings , 2005, Journal of Microelectromechanical Systems.

[18]  M. S. Rodgers,et al.  Single-step assembly of complex 3-D microstructures , 2000, Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308).

[19]  Hirotaka Sato,et al.  Recent Developments in the Remote Radio Control of Insect Flight , 2010, Front. Neurosci..

[20]  Sung-Pil Chang,et al.  Demonstration for integrating capacitive pressure sensors with read-out circuitry on stainless steel substrate , 2004 .