Parametric Study on the Drop-Impact Behaviour of Mini Hi-Fi Audio Products

Publisher Summary Most electronic devices suffer from impact-induced failure in their usage. Drop/impact performance of these products is one of the most important concerns in product design. It is often time and cost consuming and thus undesirable to conduct drop tests for every design to physically detect any sign of failure and identify their drop behaviors. Finite element analysis provides a vital and powerful tool to solve the problems. The methodology of finite element modeling, simulation, and basic experimental validation should be developed to effectively study the drop-impact effects. Modeling and transient drop analysis for a mini Hi-Fi audio product is considered in this chapter. The impact analysis of the base-drop with buffer, hitting the concrete floor, is the main interest and concern of the chapter. The model is created with Pro-E, and the analysis is carried out with an existing software package. The analysis is focused on the deformation of the bottom plate that is carrying a transformer. The deflection measured using a 3D-probe measurement is compared to the simulated results. Experimental data have also been obtained for drop simulation correlation for the plate and buffer material properties. The G-force and the permanent deformation of the bottom plate during drop are noted. The effects of the material properties to the plate deflection under drop/impact shock are also investigated in the chapter.