Inductively Coupled Connectors and Sockets for Multi-Gb/s Pulse Signaling

Multi-Gb/s pulse signaling is demonstrated with inductively coupled interconnects across packaging interfaces. This has application in realizing submillimeter pitch, true zero insertion force (ZIF) surface mount connectors, and sockets. The signaling data rate achieved in this system is from 1 to 8.5 Gbps, which depends on the 3-dB coupling frequency of the composite channel consisting of the inductive interconnections and the transmission lines. This paper presents the results of a set of experiments demonstrating this capability and describes the principles behind the design of inductively coupled sockets and connectors.

[1]  P. Franzon,et al.  Fine Pitch Inductively Coupled Connectors for Multi-Gbps Pulse Signaling , 2006, 2006 IEEE Electrical Performane of Electronic Packaging.

[2]  Paul D. Franzon,et al.  3 gb/s AC coupled chip-to-chip communication using a low swing pulse receiver , 2006, IEEE Journal of Solid-State Circuits.

[3]  Karthik Chandrasekar Inductively coupled connectors , 2009 .

[4]  U. A. Shrivastava,et al.  Package electrical specifications for giga bit signaling I/Os , 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..

[5]  Stephen Mick,et al.  AC Coupled Interconnect for Dense 3-D Systems , 2003 .

[6]  P. Franzon,et al.  2.8 Gb/s inductively coupled interconnect for 3D ICs , 2005, Digest of Technical Papers. 2005 Symposium on VLSI Circuits, 2005..

[7]  Paul D. Franzon,et al.  4 Gbps high-density AC coupled interconnection , 2002, Proceedings of the IEEE 2002 Custom Integrated Circuits Conference (Cat. No.02CH37285).

[8]  Shwetabh Verma,et al.  On-chip Inductors and Transformers , 1999 .

[9]  Jian Xu,et al.  Demystifying 3D ICs: the pros and cons of going vertical , 2005, IEEE Design & Test of Computers.

[10]  P. Franzon,et al.  Inductively Coupled Board-to-Board Connectors , 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..

[11]  N. Miura,et al.  A 1.2Gb/s/pin wireless superconnect based on inductive inter-chip signaling (IIS) , 2004, 2004 IEEE International Solid-State Circuits Conference (IEEE Cat. No.04CH37519).

[12]  S.Y.Y. Leung,et al.  Inductance tolerance analyses and design-process map of embedded planar spiral inductor , 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

[13]  John S. Corbin,et al.  Land grid array sockets for server applications , 2002, IBM J. Res. Dev..

[14]  Paul D. Franzon,et al.  Fully integrated AC coupled interconnect using buried bumps , 2005 .