An algorithm for the direct co-simulation of dynamic compact models of packages with the detailed thermal models of boards

The paper presents an algorithm for the co-simulation of packages given with RC compact models and printed circuit boards. This enables on one hand the correct detailed consideration of the heat transfer in the board, on the other hand the calculation of the exact junction temperatures within the packages. Considering individual heat transfer coefficients for each package, or even to each side of the packages is possible. The main advantage is that the methodology keeps the fastness and user friendliness of the board level solvers, while giving information also about the details of the temperatures within or at the surfaces of the packages.

[1]  Marta Rencz,et al.  SUNRED: A Field Solver and Compact Model Generator Tool Based on Successive Node Reduction , 1999 .

[2]  Bart Vandevelde,et al.  A generic methodology for deriving compact dynamic thermal models, applied to the PSGA package , 1998, IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A.

[3]  Andras Poppe,et al.  Integration of a network solver and a field solver for the mixed level thermal simulation of MEMS problems , 2002, Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS.

[4]  M. Rencz,et al.  Inclusion of RC compact models of packages into board level thermal simulation tools , 2002, Eighteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium. Proceedings 2002 (Cat.No.02CH37311).

[5]  Clemens J. M. Lasance The European project PROFIT: prediction of temperature gradients influencing the quality of electronic products , 2001, Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189).

[6]  G. Noebauer,et al.  Creating compact models using standard spreadsheet software , 2001, Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189).

[7]  Andras Poppe,et al.  THERMAN: a thermal simulation tool for IC chips, microstructures and PW boards , 2000 .