Transient Simulation of Lossy Interconnects Based on a Dispersive Hybrid Phase-Pole Macromodel

A transient simulator for interconnect structures that are modeled by lossy transmission lines is outlined in this paper. Since frequency-dependent RLGC parameters must be employed to correctly model skin effects and dielectric losses for high-performance interconnects, we first study the behaviors of various lossy interconnects that are characterized by frequency-dependent line parameters (FDLPs). We then developed a frequency-domain dispersive hybrid phase-pole macromodel (DHPPM) for such lines, which consists of a constant RLGC propagation function multiplied by a residue series. The basic idea is to first extract the dominant physical phenomenology by using a propagation function in the frequency domain that is modeled by frequency-independent line parameters (FILPs). A rational function approximation is then used to account for the remaining effects of FDLP lines. By using a partial fraction expansion and analytically evaluating the required inverse Fourier transform integrals, the time-domain DHPPM can be decomposed as a sum of canonical transient responses for lines with FILP for various excitations (e.g., trapezoidal and unit step). These canonical transient responses are then expressed analytically as closed-form expressions involving incomplete Lipshitz-Hankel integrals of the first kind and Bessel functions. The closed-form expressions for these canonical responses are validated by comparing with simulation results from commercial tools like HSPICE. The DHPPM simulator can simulate transient results for various input waveforms on both single and coupled interconnect structures. Comparisons between the DHPPM results and the results produced by commercial simulation tools like HSPICE and a numerical inverse fast Fourier transform show that the DHPPM results are very accurate.

[1]  Steven L. Dvorak,et al.  Propagation of UWB Electromagnetic Pulses Through Dispersive Media , 1995 .

[2]  A. Semlyen,et al.  Simulation of transmission line transients using vector fitting and modal decomposition , 1998 .

[3]  S.L. Dvorak,et al.  Application of recursive convolution to transient simulation of interconnects using a hybrid phase-pole macromodel , 2004, IEEE Transactions on Advanced Packaging.

[4]  S. Grivet-Talocia,et al.  TOPLine: a delay-pole-residue method for the simulation of lossy and dispersive interconnects , 2002, Electrical Performance of Electronic Packaging,.

[5]  S. Dvorak Exact, closed-form expressions for transient fields in homogeneously filled waveguides , 1994 .

[6]  Tingdong Zhou,et al.  Lossy transmission line simulation based on closed-form triangle impulse responses , 2003, IEEE Trans. Comput. Aided Des. Integr. Circuits Syst..

[7]  Paul W. Coteus,et al.  Frequency-dependent losses on high-performance interconnections , 2001 .

[8]  Andreas Weisshaar,et al.  Accurate closed-form expressions for the frequency-dependent line parameters of coupled on-chip interconnects on silicon substrate , 2001, IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565).

[9]  Edward F. Kuester,et al.  Numerical computation of the incomplete Lipschitz-Hankel integral Je o ( a, z ) , 1990 .

[10]  C. S. Chang,et al.  Coupled lossy transmission line characterization and simulation , 1981 .

[11]  Steven L. Dvorak,et al.  Series expansions for the incomplete Lipschitz‐Hankel integral Je0(a, z) , 1995 .

[12]  A. Semlyen,et al.  Rational approximation of frequency domain responses by vector fitting , 1999 .

[13]  S. Grivet-Talocia,et al.  Transient analysis of lossy transmission lines: an efficient approach based on the method of Characteristics , 2004, IEEE Transactions on Advanced Packaging.

[14]  M. Brereton Classical Electrodynamics (2nd edn) , 1976 .

[15]  Tingdong Zhou,et al.  Triangle impulse response (TIR) calculation for lossy transmission line simulation , 2001, IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565).

[16]  Hai Lan,et al.  Accurate closed-form expressions for the frequency-dependent line parameters of on-chip interconnects on lossy silicon substrate , 2001, 2001 IEEE MTT-S International Microwave Sympsoium Digest (Cat. No.01CH37157).

[17]  H. Hasegawa,et al.  Properties of Microstrip Line on Si-SiO/sub 2/ System , 1971 .

[18]  Tao Hu,et al.  A study of a hybrid phase-pole macromodel for transient simulation of complex interconnects structures , 2005, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems.

[19]  Jun-Fa Mao,et al.  Transient analysis of lossy interconnects by modified method of characteristics , 2000 .

[20]  Jaijeet S. Roychowdhury,et al.  Efficient transient simulation of lossy interconnect , 1991, 28th ACM/IEEE Design Automation Conference.

[21]  R. Achar,et al.  DEPACT: delay extraction-based passive compact transmission-line macromodeling algorithm , 2005, IEEE Transactions on Advanced Packaging.

[22]  Jr. F.H. Branin,et al.  Transient analysis of lossless transmission lines , 1967 .

[23]  J. Jackson,et al.  Classical Electrodynamics, 2nd Edition , 1975 .

[24]  John L. Prince,et al.  Improved global rational approximation macromodeling algorithm for networks characterized by frequency-sampled data , 2000 .

[25]  Jose E. Schutt-Aine,et al.  Optimal transient simulation of transmission lines , 1996 .

[26]  B. Gustavsen,et al.  Enforcing Passivity for Admittance Matrices Approximated by Rational Functions , 2001, IEEE Power Engineering Review.